Issued Patents All Time
Showing 1–25 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424453 | Low temperature direct copper-copper bonding | Stephen J. Banik, II, Justin Oberst, Kari Thorkelsson, Thomas A. Ponnuswamy | 2025-09-23 |
| 12331421 | Edge removal for through-resist plating in an electro-plating cup assembly | Stephen J. Banik, II | 2025-06-17 |
| 12293943 | Gold through silicon mask plating | Lee Peng Chua, Defu Liang, Jacob Kurtis Blickensderfer, Thomas A. Ponnuswamy, Steven T. Mayer | 2025-05-06 |
| 12247310 | Lipseal edge exclusion engineering to maintain material integrity at wafer edge | Justin Oberst, Kari Thorkelsson | 2025-03-11 |
| 12157949 | Cross flow conduit for foaming prevention in high convection plating cells | Stephen J. Banik, II, Aaron Berke, Gabriel Hay Graham, Gregory J. Kearns, Lee Peng Chua | 2024-12-03 |
| 12134831 | Apparatus for an inert anode plating cell | Gregory J. Kearns, Jacob Kurtis Blickensderfer | 2024-11-05 |
| 11746435 | Removing bubbles from plating cells | Stephen J. Banik, II, Gabriel Hay Graham, Alfred Bostick, Sean Wilbur, John Floyd Ostrowski | 2023-09-05 |
| 11699590 | Copper electrodeposition sequence for the filling of cobalt lined features | Jeyavel Velmurugan, Thomas A. Ponnuswamy | 2023-07-11 |
| 11655556 | Flow assisted dynamic seal for high-convection, continuous-rotation plating | Aaron Berke, Stephen J. Banik, II, Robert Rash | 2023-05-23 |
| 11585007 | Cross flow conduit for foaming prevention in high convection plating cells | Stephen J. Banik, II, Aaron Berke, Gabriel Hay Graham, Gregory J. Kearns, Lee Peng Chua | 2023-02-21 |
| 11560642 | Apparatus for an inert anode plating cell | Gregory J. Kearns, Jacob Kurtis Blickensderfer | 2023-01-24 |
| 11549192 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Robert Rash | 2023-01-10 |
| 11450631 | Alternative integration for redistribution layer process | Justin Oberst, Stephen J. Banik, II | 2022-09-20 |
| 11214887 | Removing bubbles from plating cell | Stephen J. Banik, II, Gabriel Hay Graham, Alfred Bostick, Sean Wilbur, John Floyd Ostrowski | 2022-01-04 |
| 11168407 | Copper electrodeposition on cobalt lined features | Jeyavel Velmurugan, Thomas A. Ponnuswamy | 2021-11-09 |
| 11047059 | Dynamic modulation of cross flow manifold during elecroplating | Kari Thorkelsson, Aaron Berke, Steven T. Mayer | 2021-06-29 |
| 11001934 | Methods and apparatus for flow isolation and focusing during electroplating | Stephen J. Banik, II, Aaron Berke, James Isaac Fortner, Justin Oberst, Steven T. Mayer +1 more | 2021-05-11 |
| 10968531 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill | 2021-04-06 |
| 10954604 | Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes | — | 2021-03-23 |
| 10930511 | Copper electrodeposition sequence for the filling of cobalt lined features | Jeyavel Velmurugan, Thomas A. Ponnuswamy | 2021-02-23 |
| 10923340 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Lee Peng Chua, Aaron Berke, Robert Rash, Steven T. Mayer | 2021-02-16 |
| 10920335 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Robert Rash | 2021-02-16 |
| 10781527 | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating | Stephen J. Banik, II, Aaron Berke, Robert Rash | 2020-09-22 |
| 10760178 | Method and apparatus for synchronized pressure regulation of separated anode chamber | Stephen J. Banik, II, Frederick Dean Wilmot, Robert Rash | 2020-09-01 |
| 10714436 | Systems and methods for achieving uniformity across a redistribution layer | Thomas A. Ponnuswamy, Steven T. Mayer, Stephen J. Banik, II, Justin Oberst | 2020-07-14 |