Issued Patents All Time
Showing 51–75 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9567685 | Apparatus and method for dynamic control of plated uniformity with the use of remote electric current | Burhanuddin Kagajwala, Steven T. Mayer, Lee Peng Chua, Aaron Berke, James Isaac Fortner +1 more | 2017-02-14 |
| 9523155 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo, Robert Rash +1 more | 2016-12-20 |
| 9469912 | Pretreatment method for photoresist wafer processing | Mark L. Rea | 2016-10-18 |
| 9455139 | Methods and apparatus for wetting pretreatment for through resist metal plating | Steven T. Mayer, Thomas A. Ponnuswamy, Robert Rash, Brian Paul Blackman, Doug Higley | 2016-09-27 |
| 9449808 | Apparatus for advanced packaging applications | Steven T. Mayer, David W. Porter, Thomas A. Ponnuswamy | 2016-09-20 |
| 9412713 | Treatment method of electrodeposited copper for wafer-level-packaging process flow | Steven T. Mayer, Thomas A. Ponnuswamy, David W. Porter | 2016-08-09 |
| 9394620 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, David W. Porter, Edwin Goh, Robert Rash | 2016-07-19 |
| 9260793 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Robert Rash | 2016-02-16 |
| 9138784 | Deionized water conditioning system and methods | Jeffrey A. Hawkins, Charles Merrill, Jason Daniel Marchetti, Kousik Ganesan | 2015-09-22 |
| 9045841 | Control of electrolyte composition in a copper electroplating apparatus | Jonathan D. Reid, John Sukamto, Zhian He, Seshasayee Varadarajan, Steven T. Mayer | 2015-06-02 |
| 9028666 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill | 2015-05-12 |
| 8858774 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Robert Rash | 2014-10-14 |
| 8500983 | Pulse sequence for plating on thin seed layers | Thomas A. Ponnuswamy, Bryan Pennington, Clifford Raymond Berry, Steven T. Mayer | 2013-08-06 |
| 8398831 | Rapidly cleanable electroplating cup seal | Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid +2 more | 2013-03-19 |
| 8377268 | Electroplating cup assembly | Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid +2 more | 2013-02-19 |
| 8308931 | Method and apparatus for electroplating | Jonathan D. Reid, Zhian He, Seyang Park, Seshasayee Varadarajan, Bryan Pennington +4 more | 2012-11-13 |
| 8217513 | Remote plasma processing of interface surfaces | George Andrew Antonelli, Jennifer O'Loughlin, Tony Xavier, Mandyam Sriram, Bart J. van Schravendijk +2 more | 2012-07-10 |
| 8172992 | Wafer electroplating apparatus for reducing edge defects | Vinay Prabhakar, Kousik Ganesan, Shantinath Ghongadi, Zhian He, Steven T. Mayer +4 more | 2012-05-08 |
| 8128791 | Control of electrolyte composition in a copper electroplating apparatus | Jonathan D. Reid, John Sukamto, Zhian He, Seshasayee Varadarajan, Steven T. Mayer | 2012-03-06 |
| 8084339 | Remote plasma processing of interface surfaces | George Andrew Antonelli, Jennifer O'Loughlin, Tony Xavier, Mandyam Sriram, Bart J. van Schravendijk +2 more | 2011-12-27 |
| 7985325 | Closed contact electroplating cup assembly | Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid +2 more | 2011-07-26 |
| 7935231 | Rapidly cleanable electroplating cup assembly | Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid +2 more | 2011-05-03 |
| 7854828 | Method and apparatus for electroplating including remotely positioned second cathode | Jonathan D. Reid, Seshasayee Varadarajan, Patrick Breiling, Glenn Ibarreta | 2010-12-21 |
| 7727863 | Sonic irradiation during wafer immersion | Jonathan D. Reid, Johanes H. Sukamto, Frederick Dean Wilmot, Richard S. Hill | 2010-06-01 |
| 6884335 | Electroplating using DC current interruption and variable rotation rate | Eric G. Webb, Jonathan D. Reid, John Sukamto, Sesha Varadarajan, Margolita M. Pollack +1 more | 2005-04-26 |