| 12157949 |
Cross flow conduit for foaming prevention in high convection plating cells |
Stephen J. Banik, II, Gabriel Hay Graham, Gregory J. Kearns, Lee Peng Chua, Bryan L. Buckalew |
2024-12-03 |
| 11655556 |
Flow assisted dynamic seal for high-convection, continuous-rotation plating |
Stephen J. Banik, II, Bryan L. Buckalew, Robert Rash |
2023-05-23 |
| 11585007 |
Cross flow conduit for foaming prevention in high convection plating cells |
Stephen J. Banik, II, Gabriel Hay Graham, Gregory J. Kearns, Lee Peng Chua, Bryan L. Buckalew |
2023-02-21 |
| 11047059 |
Dynamic modulation of cross flow manifold during elecroplating |
Kari Thorkelsson, Bryan L. Buckalew, Steven T. Mayer |
2021-06-29 |
| 11001934 |
Methods and apparatus for flow isolation and focusing during electroplating |
Stephen J. Banik, II, Bryan L. Buckalew, James Isaac Fortner, Justin Oberst, Steven T. Mayer +1 more |
2021-05-11 |
| 10982346 |
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
Robert Rash, Steven T. Mayer, Santosh Kumar, Lee Peng Chua |
2021-04-20 |
| 10969036 |
High flow multi-way piston valve for deposition systems |
James Isaac Fortner, Robert Rash, Jingbin Feng |
2021-04-06 |
| 10923340 |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Robert Rash, Steven T. Mayer |
2021-02-16 |
| 10781527 |
Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
Stephen J. Banik, II, Bryan L. Buckalew, Robert Rash |
2020-09-22 |
| 10612151 |
Flow assisted dynamic seal for high-convection, continuous-rotation plating |
Stephen J. Banik, II, Bryan L. Buckalew, Robert Rash |
2020-04-07 |
| 10364505 |
Dynamic modulation of cross flow manifold during elecroplating |
Kari Thorkelsson, Bryan L. Buckalew, Steven T. Mayer |
2019-07-30 |
| 10053793 |
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
Robert Rash, Steven T. Mayer, Santosh Kumar, Lee Peng Chua |
2018-08-21 |
| 10014170 |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Robert Rash, Steven T. Mayer |
2018-07-03 |
| 9988733 |
Apparatus and method for modulating azimuthal uniformity in electroplating |
Gabriel Hay Graham, Lee Peng Chua, Steven T. Mayer, Robert Rash |
2018-06-05 |
| 9752248 |
Methods and apparatuses for dynamically tunable wafer-edge electroplating |
Burhanuddin Kagajwala, Bryan L. Buckalew, James Isaac Fortner, Robert Rash |
2017-09-05 |
| 9567685 |
Apparatus and method for dynamic control of plated uniformity with the use of remote electric current |
Burhanuddin Kagajwala, Bryan L. Buckalew, Steven T. Mayer, Lee Peng Chua, James Isaac Fortner +1 more |
2017-02-14 |
