Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157949 | Cross flow conduit for foaming prevention in high convection plating cells | Stephen J. Banik, II, Gabriel Hay Graham, Gregory J. Kearns, Lee Peng Chua, Bryan L. Buckalew | 2024-12-03 |
| 11655556 | Flow assisted dynamic seal for high-convection, continuous-rotation plating | Stephen J. Banik, II, Bryan L. Buckalew, Robert Rash | 2023-05-23 |
| 11585007 | Cross flow conduit for foaming prevention in high convection plating cells | Stephen J. Banik, II, Gabriel Hay Graham, Gregory J. Kearns, Lee Peng Chua, Bryan L. Buckalew | 2023-02-21 |
| 11047059 | Dynamic modulation of cross flow manifold during elecroplating | Kari Thorkelsson, Bryan L. Buckalew, Steven T. Mayer | 2021-06-29 |
| 11001934 | Methods and apparatus for flow isolation and focusing during electroplating | Stephen J. Banik, II, Bryan L. Buckalew, James Isaac Fortner, Justin Oberst, Steven T. Mayer +1 more | 2021-05-11 |
| 10982346 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Robert Rash, Steven T. Mayer, Santosh Kumar, Lee Peng Chua | 2021-04-20 |
| 10969036 | High flow multi-way piston valve for deposition systems | James Isaac Fortner, Robert Rash, Jingbin Feng | 2021-04-06 |
| 10923340 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Robert Rash, Steven T. Mayer | 2021-02-16 |
| 10781527 | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating | Stephen J. Banik, II, Bryan L. Buckalew, Robert Rash | 2020-09-22 |
| 10612151 | Flow assisted dynamic seal for high-convection, continuous-rotation plating | Stephen J. Banik, II, Bryan L. Buckalew, Robert Rash | 2020-04-07 |
| 10364505 | Dynamic modulation of cross flow manifold during elecroplating | Kari Thorkelsson, Bryan L. Buckalew, Steven T. Mayer | 2019-07-30 |
| 10053793 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Robert Rash, Steven T. Mayer, Santosh Kumar, Lee Peng Chua | 2018-08-21 |
| 10014170 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Robert Rash, Steven T. Mayer | 2018-07-03 |
| 9988733 | Apparatus and method for modulating azimuthal uniformity in electroplating | Gabriel Hay Graham, Lee Peng Chua, Steven T. Mayer, Robert Rash | 2018-06-05 |
| 9752248 | Methods and apparatuses for dynamically tunable wafer-edge electroplating | Burhanuddin Kagajwala, Bryan L. Buckalew, James Isaac Fortner, Robert Rash | 2017-09-05 |
| 9567685 | Apparatus and method for dynamic control of plated uniformity with the use of remote electric current | Burhanuddin Kagajwala, Bryan L. Buckalew, Steven T. Mayer, Lee Peng Chua, James Isaac Fortner +1 more | 2017-02-14 |