| 12385138 |
Plasma-enhanced deposition of film stacks |
Jason Dirk Haverkamp, Pramod Subramonium, Joseph L. Womack, Dong Niu, Keith Fox +5 more |
2025-08-12 |
|
| 12331402 |
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
Rachel E. Batzer, Huatan Qiu, Bhadri N. Varadarajan, Bo Gong, Will Schlosser +3 more |
2025-06-17 |
|
| 12142509 |
Electrostatic chuck with seal surface |
Michael Philip Roberts, Chloe Baldasseroni, Ishtak Karim, Adrien LaVoie, Ramesh Chandrasekharan |
2024-11-12 |
$134,411,000 |
| 12000047 |
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
Rachel E. Batzer, Huatan Qiu, Bhadri N. Varadarajan, Bo Gong, Will Schlosser +3 more |
2024-06-04 |
$167,357,000 |
| 11837443 |
Showerhead faceplate having flow apertures configured for hollow cathode discharge suppression |
Michael John Selep, Karl Leeser, Timothy Scott Thomas, David William Kamp, Sean M. Donnelly |
2023-12-05 |
$84,518,000 |
| 11608559 |
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
Rachel E. Batzer, Huatan Qiu, Bhadri N. Varadarajan, Bo Gong, Will Schlosser +3 more |
2023-03-21 |
$295,628,000 |
| 11515124 |
Showerhead faceplate having flow apertures configured for hollow cathode discharge suppression |
Michael John Selep, Karl Leeser, Timothy Scott Thomas, David William Kamp, Sean M. Donnelly |
2022-11-29 |
$184,994,000 |
| 11443975 |
Planar substrate edge contact with open volume equalization pathways and side containment |
Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie, Chloe Baldasseroni +7 more |
2022-09-13 |
$233,874,000 |
| 11232966 |
Electrostatic chucking pedestal with substrate backside purging and thermal sinking |
Timothy Scott Thomas, Ramesh Chandrasekharan, Vincent E. Burkhart |
2022-01-25 |
$320,568,000 |
| 11101164 |
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
Rachel E. Batzer, Huatan Qiu, Bhadri N. Varadarajan, Bo Gong, Will Schlosser +3 more |
2021-08-24 |
$241,318,000 |
| 10984987 |
Showerhead faceplate having flow apertures configured for hollow cathode discharge suppression |
Michael John Selep, Karl Leeser, Timothy Scott Thomas, David William Kamp, Sean M. Donnelly |
2021-04-20 |
$284,078,000 |
| 10655224 |
Conical wafer centering and holding device for semiconductor processing |
Pulkit Agarwal, Ishtak Karim, Purushottam Kumar, Adrien LaVoie, Sung Je Kim |
2020-05-19 |
$40,560,000 |
| 10622243 |
Planar substrate edge contact with open volume equalization pathways and side containment |
Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie, Chloe Baldasseroni +7 more |
2020-04-14 |
|
| 10604841 |
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
Rachel E. Batzer, Huatan Qiu, Bhadri N. Varadarajan, Bo Gong, Will Schlosser +3 more |
2020-03-31 |
$259,981,000 |
| 10214816 |
PECVD apparatus for in-situ deposition of film stacks |
Jason Dirk Haverkamp, Pramod Subramonium, Joseph L. Womack, Dong Niu, Keith Fox +5 more |
2019-02-26 |
|
| 9758868 |
Plasma suppression behind a showerhead through the use of increased pressure |
Ramesh Chandrasekharan, Edmund Minshall, Colin F. Smith, Andrew Duvall, Karl Leeser |
2017-09-12 |
$38,105,000 |
| 9399228 |
Method and apparatus for purging and plasma suppression in a process chamber |
Kevin Gerber, Jennifer O'Loughlin, Nagraj Shankar, Pramod Subramonium |
2016-07-26 |
|
| 9028924 |
In-situ deposition of film stacks |
Jason Dirk Haverkamp, Pramod Subramonium, Joe Womack, Dong Niu, Keith Fox +5 more |
2015-05-12 |
|
| 8741394 |
In-situ deposition of film stacks |
Jason Dirk Haverkamp, Pramod Subramonium, Joe Womack, Dong Niu, Keith Fox +5 more |
2014-06-03 |
|
| 7854828 |
Method and apparatus for electroplating including remotely positioned second cathode |
Jonathan D. Reid, Seshasayee Varadarajan, Bryan L. Buckalew, Glenn Ibarreta |
2010-12-21 |
$7,631,000 |
| 7413616 |
Active rinse shield for electrofill chemical bath and method of use |
John D Rasberry, Steve C Schlegel |
2008-08-19 |
$16,948,000 |
| 7146994 |
Active rinse shield for electrofill chemical bath and method of use |
John D Rasberry, Steve C Schlegel |
2006-12-12 |
$14,863,000 |
