Issued Patents All Time
Showing 25 most recent of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431349 | In-situ control of film properties during atomic layer deposition | Douglas Walter Agnew, Joseph R. Abel, Ian John Curtin, Awnish Gupta | 2025-09-30 |
| 12354871 | Ultrathin atomic layer deposition film accuracy thickness control | Jun Qian, Hu Kang, Adrien LaVoie, Seiji Matsuyama | 2025-07-08 |
| 12322619 | Dynamic process control in semiconductor manufacturing | Tengfei Miao, Gengwei Jiang, Daniel Ho, Joseph R. Abel, Siddappa Attur +1 more | 2025-06-03 |
| 12288685 | Modifying hydrophobicity of a wafer surface using an organosilicon precursor | Jeremy David Fields, Awnish Gupta, Douglas Walter Agnew, Joseph R. Abel | 2025-04-29 |
| 12125705 | Method for providing doped silicon using a diffusion barrier layer | Gengwei Jiang, Bart J. van Schravendijk, Tengfei Miao, Joseph R. Abel, Adrien LaVoie | 2024-10-22 |
| 12077859 | Variable cycle and time RF activation method for film thickness matching in a multi-station deposition system | Ishtak Karim, Kiyong Cho, Adrien LaVoie, Jaswinder Guliani, Jun Qian | 2024-09-03 |
| 12057300 | Apparatus for cleaning plasma chambers | Adrien LaVoie, Pulkit Agarwal, Frank L. Pasquale | 2024-08-06 |
| 12049699 | Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etching | Joseph R. Abel, Bart J. van Schravendijk, Adrien LaVoie | 2024-07-30 |
| 12020923 | Low-κ ALD gap-fill methods and material | Joseph R. Abel, Douglas Walter Agnew, Adrien LaVoie, Ian John Curtin | 2024-06-25 |
| 11970772 | Dynamic precursor dosing for atomic layer deposition | Adrien LaVoie, Jun Qian, Hu Kang, Ishtak Karim, Fung Suong Ou | 2024-04-30 |
| 11913113 | Method and apparatus for modulating film uniformity | Pulkit Agarwal, Adrien LaVoie | 2024-02-27 |
| 11670503 | Method of atomic layer deposition | Jun Qian, Hu Kang, Adrien LaVoie, Seiji Matsuyama | 2023-06-06 |
| 11651963 | Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film | Ishtak Karim, Pulkit Agarwal, Joseph R. Abel, Adrien LaVoie | 2023-05-16 |
| 11646198 | Ultrathin atomic layer deposition film accuracy thickness control | Jun Qian, Hu Kang, Adrien LaVoie, Seiji Matsuyama | 2023-05-09 |
| 11479856 | Multi-cycle ALD process for film uniformity and thickness profile modulation | Adrien LaVoie, Hu Kang, Jun Qian, Tuan Nguyen, Ye Wang | 2022-10-25 |
| 11373862 | Surface modified depth controlled deposition for plasma based deposition | Joseph R. Abel, Adrien LaVoie | 2022-06-28 |
| 11322416 | Controller for controlling core critical dimension variation using flash trim sequence | Pulkit Agarwal, Adrien LaVoie, Ravi Kumar | 2022-05-03 |
| 11293098 | Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etching | Joseph R. Abel, Bart J. van Schravendijk, Adrien LaVoie | 2022-04-05 |
| 11255017 | Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing system | Jun Qian, Adrien LaVoie, You Zhai, Jeremiah Baldwin, Sung Je Kim | 2022-02-22 |
| 11180850 | Dynamic precursor dosing for atomic layer deposition | Adrien LaVoie, Jun Qian, Hu Kang, Ishtak Karim, Fung Suong Ou | 2021-11-23 |
| 11101129 | Ultrathin atomic layer deposition film accuracy thickness control | Jun Qian, Hu Kang, Adrien LaVoie, Seiji Matsuyama | 2021-08-24 |
| 11021792 | Symmetric precursor delivery | Eli Jeon, Adrien LaVoie, Jeffrey Kersten, Gautam Dhar | 2021-06-01 |
| 10978302 | Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film | Ishtak Karim, Pulkit Agarwal, Joseph R. Abel, Adrien LaVoie | 2021-04-13 |
| 10847352 | Compensating chamber and process effects to improve critical dimension variation for trim process | Pulkit Agarwal, Adrien LaVoie, Ravi Kumar | 2020-11-24 |
| 10832909 | Atomic layer etch, reactive precursors and energetic sources for patterning applications | Adrien LaVoie, Puikit Agarwal | 2020-11-10 |