Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443975 | Planar substrate edge contact with open volume equalization pathways and side containment | Patrick Breiling, Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie +7 more | 2022-09-13 |
| 10622243 | Planar substrate edge contact with open volume equalization pathways and side containment | Patrick Breiling, Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie +7 more | 2020-04-14 |
| 10115608 | Method and apparatus for rapid pump-down of a high-vacuum loadlock | Victor F. Morris, Ram Charan, Ronald A. Powell, Mukul Khosla | 2018-10-30 |
| 9758868 | Plasma suppression behind a showerhead through the use of increased pressure | Patrick Breiling, Ramesh Chandrasekharan, Colin F. Smith, Andrew Duvall, Karl Leeser | 2017-09-12 |
| 8415261 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2013-04-09 |
| 8257781 | Electroless plating-liquid system | Eric G. Webb, Steven T. Mayer, David Mark Dinneen, Christopher M. Bartlett, R. Marshall Stowell +6 more | 2012-09-04 |
| 8043958 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2011-10-25 |
| 7811925 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2010-10-12 |
| 7690324 | Small-volume electroless plating cell | Jingbin Feng, Steven T. Mayer, Daniel Mark Dinneen, Christopher M. Bartlett, Eric G. Webb +6 more | 2010-04-06 |
| 7605082 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2009-10-20 |
| 7229339 | CMP apparatus and method | John F. Stumpf, Franklin D. Root, Brian Severson, David Marquardt, John D. Herb +6 more | 2007-06-12 |
| 7048316 | Compound angled pad end-effector | Richard M. Blank, Simon C. S. Chan, Peter J. Woytowitz | 2006-05-23 |
| 6815349 | Electroless copper deposition apparatus | Kevin Biggs, R. Marshall Stowell, Wayne Fetters | 2004-11-09 |
| 6755954 | Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements | Steven T. Mayer, Timothy Cleary, Michael J. Janicki, Thomas A. Ponnuswamy | 2004-06-29 |