Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7897198 | Electroless layer plating process and apparatus | Heung Lak Park, Eric G. Webb, Jonathan D. Reid | 2011-03-01 |
| 7531463 | Fabrication of semiconductor interconnect structure | Daniel A. Koos, Steven T. Mayer, Heung Lak Park, Thomas W. Mountsier | 2009-05-12 |
| 7338908 | Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage | Daniel A. Koos, Steven T. Mayer, Heung Lak Park, Thomas W. Mountsier | 2008-03-04 |
| 7229339 | CMP apparatus and method | John F. Stumpf, Franklin D. Root, Brian Severson, David Marquardt, John D. Herb +6 more | 2007-06-12 |
| 6755954 | Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements | Steven T. Mayer, Michael J. Janicki, Edmund Minshall, Thomas A. Ponnuswamy | 2004-06-29 |