Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12281402 | Low angle membrane frame for an electroplating cell | Robert Rash, Nirmal Shankar SIGAMANI, Gabriel Hay Graham | 2025-04-22 |
| 10968531 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Shantinath Ghongadi, Douglas Hill, Bryan L. Buckalew | 2021-04-06 |
| 10760178 | Method and apparatus for synchronized pressure regulation of separated anode chamber | Stephen J. Banik, II, Bryan L. Buckalew, Robert Rash | 2020-09-01 |
| 10435807 | Lipseals and contact elements for semiconductor electroplating apparatuses | Jingbin Feng, Robert Marshall Stowell | 2019-10-08 |
| 10351968 | Front referenced anode | Jingbin Feng, R. Marshall Stowell, Shantinath Ghongadi, Zhian He | 2019-07-16 |
| 10053792 | Plating cup with contoured cup bottom | Zhian He, Jingbin Feng, Shantinath Ghongadi | 2018-08-21 |
| 10023970 | Dynamic current distribution control apparatus and method for wafer electroplating | Zhian He, David W. Porter, Jonathan D. Reid | 2018-07-17 |
| 9822461 | Dynamic current distribution control apparatus and method for wafer electroplating | Zhian He, David W. Porter, Jonathan D. Reid | 2017-11-21 |
| 9816196 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Tighe A. Spurlin, Charles Merrill, Ludan Huang, Matthew Thorum, Lee J. Brogan +9 more | 2017-11-14 |
| 9587322 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Shantinath Ghongadi, Douglas Hill, Bryan L. Buckalew | 2017-03-07 |
| 9512538 | Plating cup with contoured cup bottom | Zhian He, Jingbin Feng, Shantinath Ghongadi | 2016-12-06 |
| 9340893 | Front referenced anode | Jingbin Feng, R. Marshall Stowell, Shantinath Ghongadi, Zhian He | 2016-05-17 |
| 9228270 | Lipseals and contact elements for semiconductor electroplating apparatuses | Jingbin Feng, Marshall R. Stowell | 2016-01-05 |
| 9045840 | Dynamic current distribution control apparatus and method for wafer electroplating | David W. Porter, Jonathan D. Reid | 2015-06-02 |
| 9028666 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Shantinath Ghongadi, Douglas Hill, Bryan L. Buckalew | 2015-05-12 |
| 9028657 | Front referenced anode | Jingbin Feng, R. Marshall Stowell, Shantinath Ghongadi, Zhian He | 2015-05-12 |
| 7727863 | Sonic irradiation during wafer immersion | Bryan L. Buckalew, Jonathan D. Reid, Johanes H. Sukamto, Richard S. Hill | 2010-06-01 |