| 12507392 |
Multiple, alternating epitaxial silicon |
John F. Kaeding |
2025-12-23 |
|
| 12322585 |
Sublimation in forming a semiconductor |
— |
2025-06-03 |
|
| 12237013 |
Integrated assemblies and methods of forming integrated assemblies |
Shyam Surthi |
2025-02-25 |
|
| 12191249 |
Microelectronic devices including staircase structures, and related memory devices, electronic systems, and methods |
David H. Wells, Richard J. Hill, Umberto Maria Meotto |
2025-01-07 |
|
| 12041779 |
Integrated assemblies and methods of forming integrated assemblies |
Shyam Surthi, Kunal Shrotri |
2024-07-16 |
$30,823,000 |
| 11791152 |
Residue removal during semiconductor device formation |
— |
2023-10-17 |
$12,590,000 |
| 11600485 |
Using sacrificial solids in semiconductor processing |
Gurtej S. Sandhu |
2023-03-07 |
$10,226,000 |
| 11495610 |
Integrated circuitry, a method used in forming integrated circuitry, and a method used in forming a memory array comprising strings of memory cells |
Collin Howder, Shyam Surthi |
2022-11-08 |
$11,616,000 |
| 11482409 |
Freezing a sacrificial material in forming a semiconductor |
— |
2022-10-25 |
$11,361,000 |
| 11296103 |
Integrated assemblies and methods of forming integrated assemblies |
Shyam Surthi, Kunal Shrotri |
2022-04-05 |
$17,375,000 |
| 11037779 |
Gas residue removal |
— |
2021-06-15 |
$19,940,000 |
| 10964525 |
Removing a sacrificial material via sublimation in forming a semiconductor |
— |
2021-03-30 |
$32,966,000 |
| 10957530 |
Freezing a sacrificial material in forming a semiconductor |
— |
2021-03-23 |
$19,320,000 |
| 10943907 |
Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitry |
Cornel Bozdog, Abhilasha Bhardwaj, Byeung Chul Kim, Michael E. Koltonski, Gurtej S. Sandhu |
2021-03-09 |
$21,153,000 |
| 10937644 |
Using sacrificial solids in semiconductor processing |
Gurtej S. Sandhu |
2021-03-02 |
$19,050,000 |
| 10825686 |
Hydrosilylation in semiconductor processing |
Gurtej S. Sandhu |
2020-11-03 |
$12,106,000 |
| 10784101 |
Using sacrificial solids in semiconductor processing |
Gurtej S. Sandhu |
2020-09-22 |
$15,633,000 |
| 10774438 |
Monitoring electrolytes during electroplating |
Steven T. Mayer |
2020-09-15 |
$89,396,000 |
| 10707211 |
Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitry |
Cornel Bozdog, Abhilasha Bhardwaj, Byeung Chul Kim, Michael E. Koltonski, Gurtej S. Sandhu |
2020-07-07 |
$18,795,000 |
| 10508359 |
TSV bath evaluation using field versus feature contrast |
Lee J. Brogan, Steven T. Mayer, Joseph Richardson, David W. Porter, Haiying Fu |
2019-12-17 |
$47,535,000 |
| 10475656 |
Hydrosilylation in semiconductor processing |
Gurtej S. Sandhu |
2019-11-12 |
$21,044,000 |
| 10094038 |
Monitoring electrolytes during electroplating |
Steven T. Mayer |
2018-10-09 |
$18,504,000 |
| 9816196 |
Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte |
Tighe A. Spurlin, Charles Merrill, Ludan Huang, Lee J. Brogan, James E. Duncan +9 more |
2017-11-14 |
|
| 9689083 |
TSV bath evaluation using field versus feature contrast |
Lee J. Brogan, Steven T. Mayer, Joseph Richardson, David W. Porter, Haiying Fu |
2017-06-27 |
$21,606,000 |
| 9617648 |
Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias |
Steven T. Mayer |
2017-04-11 |
$9,143,000 |
