Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322585 | Sublimation in forming a semiconductor | — | 2025-06-03 |
| 12237013 | Integrated assemblies and methods of forming integrated assemblies | Shyam Surthi | 2025-02-25 |
| 12191249 | Microelectronic devices including staircase structures, and related memory devices, electronic systems, and methods | David H. Wells, Richard J. Hill, Umberto Maria Meotto | 2025-01-07 |
| 12041779 | Integrated assemblies and methods of forming integrated assemblies | Shyam Surthi, Kunal Shrotri | 2024-07-16 |
| 11791152 | Residue removal during semiconductor device formation | — | 2023-10-17 |
| 11600485 | Using sacrificial solids in semiconductor processing | Gurtej S. Sandhu | 2023-03-07 |
| 11495610 | Integrated circuitry, a method used in forming integrated circuitry, and a method used in forming a memory array comprising strings of memory cells | Collin Howder, Shyam Surthi | 2022-11-08 |
| 11482409 | Freezing a sacrificial material in forming a semiconductor | — | 2022-10-25 |
| 11296103 | Integrated assemblies and methods of forming integrated assemblies | Shyam Surthi, Kunal Shrotri | 2022-04-05 |
| 11037779 | Gas residue removal | — | 2021-06-15 |
| 10964525 | Removing a sacrificial material via sublimation in forming a semiconductor | — | 2021-03-30 |
| 10957530 | Freezing a sacrificial material in forming a semiconductor | — | 2021-03-23 |
| 10943907 | Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitry | Cornel Bozdog, Abhilasha Bhardwaj, Byeung Chul Kim, Michael E. Koltonski, Gurtej S. Sandhu | 2021-03-09 |
| 10937644 | Using sacrificial solids in semiconductor processing | Gurtej S. Sandhu | 2021-03-02 |
| 10825686 | Hydrosilylation in semiconductor processing | Gurtej S. Sandhu | 2020-11-03 |
| 10784101 | Using sacrificial solids in semiconductor processing | Gurtej S. Sandhu | 2020-09-22 |
| 10774438 | Monitoring electrolytes during electroplating | Steven T. Mayer | 2020-09-15 |
| 10707211 | Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitry | Cornel Bozdog, Abhilasha Bhardwaj, Byeung Chul Kim, Michael E. Koltonski, Gurtej S. Sandhu | 2020-07-07 |
| 10508359 | TSV bath evaluation using field versus feature contrast | Lee J. Brogan, Steven T. Mayer, Joseph Richardson, David W. Porter, Haiying Fu | 2019-12-17 |
| 10475656 | Hydrosilylation in semiconductor processing | Gurtej S. Sandhu | 2019-11-12 |
| 10094038 | Monitoring electrolytes during electroplating | Steven T. Mayer | 2018-10-09 |
| 9816196 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Tighe A. Spurlin, Charles Merrill, Ludan Huang, Lee J. Brogan, James E. Duncan +9 more | 2017-11-14 |
| 9689083 | TSV bath evaluation using field versus feature contrast | Lee J. Brogan, Steven T. Mayer, Joseph Richardson, David W. Porter, Haiying Fu | 2017-06-27 |
| 9617648 | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias | Steven T. Mayer | 2017-04-11 |
| 9435049 | Alkaline pretreatment for electroplating | — | 2016-09-06 |