| 12507392 |
Multiple, alternating epitaxial silicon |
Matthew Thorum |
2025-12-23 |
|
| 12324244 |
Epitaxial single crystalline silicon growth for memory arrays |
Glen H. Walters, John Smythe, Scott E. Sills |
2025-06-03 |
|
| 12272870 |
Tunable integrated millimeter wave antenna using laser ablation and/or fuses |
Owen R. Fay |
2025-04-08 |
|
| 12051670 |
Use of pre-channeled materials for anisotropic conductors |
Mark E. Tuttle, Owen R. Fay, Eiichi Nakano, Shijian Luo |
2024-07-30 |
$28,317,000 |
| 11908814 |
Fabricated two-sided millimeter wave antenna using through-silicon-vias |
Owen R. Fay |
2024-02-20 |
$18,735,000 |
| 11728276 |
Semiconductor devices having integrated optical components |
— |
2023-08-15 |
$9,169,000 |
| 11670707 |
Integrated assemblies and methods of forming integrated assemblies |
David K. Hwang, Richard J. Hill, Scott E. Sills |
2023-06-06 |
$9,972,000 |
| 11588233 |
Tunable integrated millimeter wave antenna using laser ablation and/or fuses |
Owen R. Fay |
2023-02-21 |
$8,544,000 |
| 11393920 |
Integrated assemblies and methods of forming integrated assemblies |
David K. Hwang, Richard J. Hill, Scott E. Sills |
2022-07-19 |
$10,980,000 |
| 11227777 |
Sacrificial separators for wafer level encapsulating |
— |
2022-01-18 |
$36,270,000 |
| 11139262 |
Use of pre-channeled materials for anisotropic conductors |
Mark E. Tuttle, Owen R. Fay, Eiichi Nakano, Shijian Luo |
2021-10-05 |
$16,233,000 |
| 11114383 |
Semiconductor devices having integrated optical components |
— |
2021-09-07 |
$21,620,000 |
| 11018098 |
Fabricated two-sided millimeter wave antenna using through-silicon-vias |
Owen R. Fay |
2021-05-25 |
$23,972,000 |
| 10593568 |
Thrumold post package with reverse build up hybrid additive structure |
Chan H. Yoo, Ashok Pachamuthu, Mark E. Tuttle |
2020-03-17 |
$15,937,000 |
| 10586780 |
Semiconductor device modules including a die electrically connected to posts and related methods |
Ashok Pachamuthu, Chan H. Yoo, Szu-Ying Ho |
2020-03-10 |
$23,033,000 |
| 10566686 |
Stacked memory package incorporating millimeter wave antenna in die stack |
Owen R. Fay |
2020-02-18 |
$33,488,000 |
| 10325874 |
Device module having a plurality of dies electrically connected by posts |
Ashok Pachamuthu, Chan H. Yoo, Szu-Ying Ho |
2019-06-18 |
$19,717,000 |
| 10192843 |
Methods of making semiconductor device modules with increased yield |
Ashok Pachamuthu, Chan H. Yoo, Szu-Ying Ho |
2019-01-29 |
$26,170,000 |
| 10103038 |
Thrumold post package with reverse build up hybrid additive structure |
Chan H. Yoo, Ashok Pachamuthu, Mark E. Tuttle |
2018-10-16 |
$57,370,000 |
| 8709925 |
Method for conductivity control of (Al,In,Ga,B)N |
Hitoshi Sato, Michael Iza, Hirokuni Asamizu, Hong Zhong, Steven P. DenBaars +1 more |
2014-04-29 |
|
| 8643036 |
Semiconductor light-emitting device |
Rajat Sharma, Paul Morgan Pattison, Shuji Nakamura |
2014-02-04 |
|
| 8405128 |
Method for enhancing growth of semipolar (Al,In,Ga,B)N via metalorganic chemical vapor deposition |
Hitoshi Sato, Michael Iza, Benjamin A. Haskell, Troy J. Baker, Steven P. DenBaars +1 more |
2013-03-26 |
|
| 8368179 |
Miscut semipolar optoelectronic device |
Dong-Seon Lee, Michael Iza, Troy J. Baker, Hitoshi Sato, Benjamin A. Haskell +3 more |
2013-02-05 |
|
| 8227820 |
Semiconductor light-emitting device |
Rajat Sharma, Paul Morgan Pattison, Shuji Nakamura |
2012-07-24 |
|
| 8203159 |
Method for growth of semipolar (Al,In,Ga,B)N optoelectronic devices |
Hong Zhong, Rajat Sharma, James S. Speck, Steven P. DenBaars, Shuji Nakamura |
2012-06-19 |
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