Issued Patents All Time
Showing 25 most recent of 279 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362311 | Anisotropic conductive film with carbon-based conductive regions having void space and related semiconductor device assemblies and methods | Eiichi Nakano | 2025-07-15 |
| 12218101 | Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same | Owen R. Fay, Chan H. Yoo | 2025-02-04 |
| 12080678 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Benjamin L. McClain | 2024-09-03 |
| 12051670 | Use of pre-channeled materials for anisotropic conductors | John F. Kaeding, Owen R. Fay, Eiichi Nakano, Shijian Luo | 2024-07-30 |
| 11887969 | Signal delivery in stacked device | Brent Keeth, Mark Hiatt, Terry R. Lee, Rahul Advani, John F. Schreck | 2024-01-30 |
| 11881468 | Anisotropic conductive film with carbon-based conductive regions and related semiconductor device assemblies and methods | Eiichi Nakano | 2024-01-23 |
| 11784166 | Dual sided fan-out package having low warpage across all temperatures | Chan H. Yoo | 2023-10-10 |
| 11756844 | Semiconductor device with a protection mechanism and associated systems, devices, and methods | Wei Zhou, Bret K. Street | 2023-09-12 |
| 11745281 | Solder removal from semiconductor devices | — | 2023-09-05 |
| 11581231 | Stress tuned stiffeners for micro electronics package warpage control | Chan H. Yoo | 2023-02-14 |
| 11564331 | Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods | — | 2023-01-24 |
| 11410962 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Benjamin L. McClain | 2022-08-09 |
| 11410963 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Benjamin L. McClain | 2022-08-09 |
| 11309285 | Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same | Owen R. Fay, Chan H. Yoo | 2022-04-19 |
| 11264360 | Signal delivery in stacked device | Brent Keeth, Mark Hiatt, Terry R. Lee, Rahul Advani, John F. Schreck | 2022-03-01 |
| 11239206 | Dual sided fan-out package having low warpage across all temperatures | Chan H. Yoo | 2022-02-01 |
| 11189588 | Anisotropic conductive film with carbon-based conductive regions and related semiconductor assemblies, systems, and methods | Eiichi Nakano | 2021-11-30 |
| 11139262 | Use of pre-channeled materials for anisotropic conductors | John F. Kaeding, Owen R. Fay, Eiichi Nakano, Shijian Luo | 2021-10-05 |
| 11069612 | Semiconductor devices having electrically and optically conductive vias, and associated systems and methods | Eiichi Nakano | 2021-07-20 |
| 11020811 | Solder removal from semiconductor devices | — | 2021-06-01 |
| 10943842 | Semiconductor device with a protection mechanism and associated systems, devices, and methods | Wei Zhou, Bret K. Street | 2021-03-09 |
| 10840209 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Benjamin L. McClain | 2020-11-17 |
| 10840210 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Benjamin L. McClain | 2020-11-17 |
| 10834853 | Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods | — | 2020-11-10 |
| 10712382 | Semiconductor device structures for burn-in testing and methods thereof | — | 2020-07-14 |