| 12362311 |
Anisotropic conductive film with carbon-based conductive regions having void space and related semiconductor device assemblies and methods |
Eiichi Nakano |
2025-07-15 |
|
| 12218101 |
Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same |
Owen R. Fay, Chan H. Yoo |
2025-02-04 |
|
| 12080678 |
Methods and systems for manufacturing semiconductor devices |
Wei Zhou, Bret K. Street, Benjamin L. McClain |
2024-09-03 |
$19,072,000 |
| 12051670 |
Use of pre-channeled materials for anisotropic conductors |
John F. Kaeding, Owen R. Fay, Eiichi Nakano, Shijian Luo |
2024-07-30 |
$28,317,000 |
| 11887969 |
Signal delivery in stacked device |
Brent Keeth, Mark Hiatt, Terry R. Lee, Rahul Advani, John F. Schreck |
2024-01-30 |
|
| 11881468 |
Anisotropic conductive film with carbon-based conductive regions and related semiconductor device assemblies and methods |
Eiichi Nakano |
2024-01-23 |
$36,669,000 |
| 11784166 |
Dual sided fan-out package having low warpage across all temperatures |
Chan H. Yoo |
2023-10-10 |
$11,017,000 |
| 11756844 |
Semiconductor device with a protection mechanism and associated systems, devices, and methods |
Wei Zhou, Bret K. Street |
2023-09-12 |
$13,618,000 |
| 11745281 |
Solder removal from semiconductor devices |
— |
2023-09-05 |
$12,684,000 |
| 11581231 |
Stress tuned stiffeners for micro electronics package warpage control |
Chan H. Yoo |
2023-02-14 |
$11,066,000 |
| 11564331 |
Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods |
— |
2023-01-24 |
$10,431,000 |
| 11410962 |
Methods and systems for manufacturing semiconductor devices |
Wei Zhou, Bret K. Street, Benjamin L. McClain |
2022-08-09 |
$10,590,000 |
| 11410963 |
Methods and systems for manufacturing semiconductor devices |
Wei Zhou, Bret K. Street, Benjamin L. McClain |
2022-08-09 |
$10,590,000 |
| 11309285 |
Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same |
Owen R. Fay, Chan H. Yoo |
2022-04-19 |
$19,230,000 |
| 11264360 |
Signal delivery in stacked device |
Brent Keeth, Mark Hiatt, Terry R. Lee, Rahul Advani, John F. Schreck |
2022-03-01 |
$21,169,000 |
| 11239206 |
Dual sided fan-out package having low warpage across all temperatures |
Chan H. Yoo |
2022-02-01 |
$13,825,000 |
| 11189588 |
Anisotropic conductive film with carbon-based conductive regions and related semiconductor assemblies, systems, and methods |
Eiichi Nakano |
2021-11-30 |
$26,919,000 |
| 11139262 |
Use of pre-channeled materials for anisotropic conductors |
John F. Kaeding, Owen R. Fay, Eiichi Nakano, Shijian Luo |
2021-10-05 |
$16,233,000 |
| 11069612 |
Semiconductor devices having electrically and optically conductive vias, and associated systems and methods |
Eiichi Nakano |
2021-07-20 |
$22,424,000 |
| 11020811 |
Solder removal from semiconductor devices |
— |
2021-06-01 |
$25,615,000 |
| 10943842 |
Semiconductor device with a protection mechanism and associated systems, devices, and methods |
Wei Zhou, Bret K. Street |
2021-03-09 |
$21,153,000 |
| 10840210 |
Methods and systems for manufacturing semiconductor devices |
Wei Zhou, Bret K. Street, Benjamin L. McClain |
2020-11-17 |
$11,531,000 |
| 10840209 |
Methods and systems for manufacturing semiconductor devices |
Wei Zhou, Bret K. Street, Benjamin L. McClain |
2020-11-17 |
$11,531,000 |
| 10834853 |
Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods |
— |
2020-11-10 |
$16,985,000 |
| 10714456 |
Dual sided fan-out package having low warpage across all temperatures |
Chan H. Yoo |
2020-07-14 |
$16,930,000 |
