Issued Patents All Time
Showing 26–50 of 279 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10712382 | Semiconductor device structures for burn-in testing and methods thereof | — | 2020-07-14 |
| 10692793 | Electronic device with a package-level thermal regulator mechanism and associated systems, devices, and methods | — | 2020-06-23 |
| 10593568 | Thrumold post package with reverse build up hybrid additive structure | Chan H. Yoo, John F. Kaeding, Ashok Pachamuthu | 2020-03-17 |
| 10580710 | Semiconductor device with a protection mechanism and associated systems, devices, and methods | Wei Zhou, Bret K. Street | 2020-03-03 |
| 10529659 | Semiconductor devices having electrically and optically conductive vias, and associated systems and methods | Eiichi Nakano | 2020-01-07 |
| 10468382 | Signal delivery in stacked device | Brent Keeth, Mark Hiatt, Terry R. Lee, Rahul Advani, John F. Schreck | 2019-11-05 |
| 10396003 | Stress tuned stiffeners for micro electronics package warpage control | Chan H. Yoo | 2019-08-27 |
| 10307850 | Solder removal from semiconductor devices | — | 2019-06-04 |
| 10304805 | Dual sided fan-out package having low warpage across all temperatures | Chan H. Yoo | 2019-05-28 |
| 10261123 | Semiconductor device structures for burn-in testing and methods thereof | — | 2019-04-16 |
| 10141259 | Semiconductor devices having electrically and optically conductive vias, and associated systems and methods | Eiichi Nakano | 2018-11-27 |
| 10103038 | Thrumold post package with reverse build up hybrid additive structure | Chan H. Yoo, John F. Kaeding, Ashok Pachamuthu | 2018-10-16 |
| 9570350 | Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods | — | 2017-02-14 |
| 9324690 | Signal delivery in stacked device | Brent Keeth, Mark Hiatt, Terry R. Lee, Rahul Advani, John F. Schreck | 2016-04-26 |
| 9153614 | Method and apparatus for lens alignment for optically sensitive devices and systems implementing same | — | 2015-10-06 |
| 9099539 | Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods | — | 2015-08-04 |
| 8841146 | Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics | Jui-Kang Yen, Georg Soerensen | 2014-09-23 |
| 8736028 | Semiconductor device structures and printed circuit boards comprising semiconductor devices | — | 2014-05-27 |
| 8669179 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2014-03-11 |
| 8643474 | Computer with RFID interrogator | — | 2014-02-04 |
| 8624711 | Radio frequency identification device operating methods, radio frequency identification device configuration methods, and radio frequency identification devices | John R. Tuttle | 2014-01-07 |
| 8531298 | Flexible RFID label | Roy Greeff, Freddie W. Smith, John R. Tuttle | 2013-09-10 |
| RE44409 | Method for electronic tracking of units associated with a batch | Ross S. Dando | 2013-08-06 |
| 8502353 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2013-08-06 |
| 8405191 | Semiconductor device structures | — | 2013-03-26 |