| 10712382 |
Semiconductor device structures for burn-in testing and methods thereof |
— |
2020-07-14 |
$16,930,000 |
| 10692793 |
Electronic device with a package-level thermal regulator mechanism and associated systems, devices, and methods |
— |
2020-06-23 |
$14,650,000 |
| 10593568 |
Thrumold post package with reverse build up hybrid additive structure |
Chan H. Yoo, John F. Kaeding, Ashok Pachamuthu |
2020-03-17 |
$15,937,000 |
| 10580710 |
Semiconductor device with a protection mechanism and associated systems, devices, and methods |
Wei Zhou, Bret K. Street |
2020-03-03 |
$19,771,000 |
| 10529659 |
Semiconductor devices having electrically and optically conductive vias, and associated systems and methods |
Eiichi Nakano |
2020-01-07 |
$20,164,000 |
| 10468382 |
Signal delivery in stacked device |
Brent Keeth, Mark Hiatt, Terry R. Lee, Rahul Advani, John F. Schreck |
2019-11-05 |
$20,571,000 |
| 10396003 |
Stress tuned stiffeners for micro electronics package warpage control |
Chan H. Yoo |
2019-08-27 |
$14,447,000 |
| 10307850 |
Solder removal from semiconductor devices |
— |
2019-06-04 |
$9,801,000 |
| 10304805 |
Dual sided fan-out package having low warpage across all temperatures |
Chan H. Yoo |
2019-05-28 |
$10,177,000 |
| 10261123 |
Semiconductor device structures for burn-in testing and methods thereof |
— |
2019-04-16 |
$25,657,000 |
| 10141259 |
Semiconductor devices having electrically and optically conductive vias, and associated systems and methods |
Eiichi Nakano |
2018-11-27 |
$19,088,000 |
| 10103038 |
Thrumold post package with reverse build up hybrid additive structure |
Chan H. Yoo, John F. Kaeding, Ashok Pachamuthu |
2018-10-16 |
$57,370,000 |
| 9570350 |
Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods |
— |
2017-02-14 |
$16,273,000 |
| 9324690 |
Signal delivery in stacked device |
Brent Keeth, Mark Hiatt, Terry R. Lee, Rahul Advani, John F. Schreck |
2016-04-26 |
$9,589,000 |
| 9153614 |
Method and apparatus for lens alignment for optically sensitive devices and systems implementing same |
— |
2015-10-06 |
$10,070,000 |
| 9099539 |
Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods |
— |
2015-08-04 |
$12,551,000 |
| 8841146 |
Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics |
Jui-Kang Yen, Georg Soerensen |
2014-09-23 |
$229,000 |
| 8736028 |
Semiconductor device structures and printed circuit boards comprising semiconductor devices |
— |
2014-05-27 |
$8,446,000 |
| 8669179 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more |
2014-03-11 |
$15,851,000 |
| 8643474 |
Computer with RFID interrogator |
— |
2014-02-04 |
|
| 8624711 |
Radio frequency identification device operating methods, radio frequency identification device configuration methods, and radio frequency identification devices |
John R. Tuttle |
2014-01-07 |
|
| 8531298 |
Flexible RFID label |
Roy Greeff, Freddie W. Smith, John R. Tuttle |
2013-09-10 |
|
| 8502353 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more |
2013-08-06 |
$3,661,000 |
| RE44409 |
Method for electronic tracking of units associated with a batch |
Ross S. Dando |
2013-08-06 |
|
| 8405191 |
Semiconductor device structures |
— |
2013-03-26 |
$5,078,000 |
