Issued Patents All Time
Showing 76–100 of 279 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7583862 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | William M. Hiatt | 2009-09-01 |
| 7545256 | System and method for identifying a radio frequency identification (RFID) device | James E. O'Toole, John R. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax +4 more | 2009-06-09 |
| 7528064 | Interconnect structures with bond-pads and methods of forming bump sites on bond-pads | Sanh D. Tang, Keith R. Cook | 2009-05-05 |
| 7517798 | Methods for forming through-wafer interconnects and structures resulting therefrom | — | 2009-04-14 |
| 7452743 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level | Steven Oliver, Lu Velicky, William M. Hiatt, David R. Hembree, Sidney B. Rigg +3 more | 2008-11-18 |
| 7405966 | Magnetic tunneling junction antifuse device | Mirmajid Seyyedy, Glen E. Hush | 2008-07-29 |
| 7385477 | Radio frequency data communications device | James E. O'Toole, John R. Tuttle, Tyler F. Lowrey, Kevin M. Devereaux, George E. Pax +4 more | 2008-06-10 |
| 7345575 | Radio frequency data communications device with adjustable receiver sensitivity and method | John R. Tuttle | 2008-03-18 |
| 7342409 | System for testing semiconductor components | Warren M. Farnworth | 2008-03-11 |
| RE40137 | Methods for forming integrated circuits within substrates | Rickie C. Lake | 2008-03-04 |
| 7304491 | Interconnect for testing semiconductor components | Warren M. Farnworth | 2007-12-04 |
| 7300857 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2007-11-27 |
| 7284315 | Method of forming a magnetic tunnel junction | — | 2007-10-23 |
| 7283035 | Radio frequency data communications device with selectively removable antenna portion and method | John R. Tuttle | 2007-10-16 |
| 7282433 | Interconnect structures with bond-pads and methods of forming bump sites on bond-pads | Sanh D. Tang, Keith R. Cook | 2007-10-16 |
| 7271611 | Method for testing semiconductor components using bonded electrical connections | Warren M. Farnworth | 2007-09-18 |
| 7264768 | Single substrate annealing of magnetoresistive structure | Ronald A. Weimer | 2007-09-04 |
| 7259581 | Method for testing semiconductor components | Warren M. Farnworth | 2007-08-21 |
| 7227774 | MRAM integrated circuits, MRAM circuits, and systems for testing MRAM integrated circuits | D. Mark Durcan | 2007-06-05 |
| 7221257 | Wireless communication devices, radio frequency identification devices, methods of forming a wireless communication device, and methods of forming a radio frequency identification device | — | 2007-05-22 |
| 7176065 | Magnetic tunneling junction antifuse device | Mirmajid Seyyedy, Glen E. Hush | 2007-02-13 |
| 7170867 | Radio frequency data communications device | James E. O'Toole, John R. Tuttle, Tyler Lowrey, Kevin M. Devereaux, George E. Pax +4 more | 2007-01-30 |
| 7129534 | Magneto-resistive memory and method of manufacturing the same | — | 2006-10-31 |
| 7126200 | Integrated circuits with contemporaneously formed array electrodes and logic interconnects | Mirmajid Seyyedy, Glen E. Hush, Terry Vollman | 2006-10-24 |
| 7106201 | Communication devices, remote intelligent communication devices, electronic communication devices, methods of forming remote intelligent communication devices and methods of forming a radio frequency identification device | — | 2006-09-12 |