Issued Patents All Time
Showing 25 most recent of 134 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9998643 | Methods of forming curved image sensors | Marc Sulfridge, Andrew Perkins, Jonathan Stern | 2018-06-12 |
| 9737947 | Microfeature workpieces having alloyed conductive structures, and associated methods | Warren M. Farnworth, William M. Hiatt | 2017-08-22 |
| 9612409 | Hermetic sealing of optical module | Marc Finot | 2017-04-04 |
| 9153491 | Methods for forming conductive elements and vias on substrates and for forming multi-chip modules | — | 2015-10-06 |
| 8835293 | Methods for forming conductive elements and vias on substrates | — | 2014-09-16 |
| 8415233 | Wafer processing | — | 2013-04-09 |
| RE43940 | Method and apparatus for RFID communication | Mark E. Tuttle, Steven F. Schicht, John R. Tuttle | 2013-01-22 |
| RE43935 | Method and apparatus for RFID communication | Mark E. Tuttle, Steven F. Schicht, John R. Tuttle | 2013-01-15 |
| RE43918 | Method and apparatus for RFID communication | Mark E. Tuttle, Steven F. Schicht, John R. Tuttle | 2013-01-08 |
| 8183151 | Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom | — | 2012-05-22 |
| RE42872 | Method and apparatus for communicating with RFID devices coupled to a roll of flexible material | Mark E. Tuttle, Steven F. Schicht, John R. Tuttle | 2011-10-25 |
| RE42773 | Method of manufacturing an enclosed transceiver | Mark E. Tuttle, John R. Tuttle | 2011-10-04 |
| 7972940 | Wafer processing | — | 2011-07-05 |
| 7968042 | Method and apparatus for step-and-repeat molding | — | 2011-06-28 |
| 7927916 | Optic wafer with reliefs, wafer assembly including same and methods of dicing wafer assembly | — | 2011-04-19 |
| 7888758 | Method of forming a permanent carrier and spacer wafer for wafer level optics and associated structure | — | 2011-02-15 |
| 7723741 | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree | 2010-05-25 |
| 7687916 | Semiconductor substrates including vias of nonuniform cross-section and associated structures | — | 2010-03-30 |
| 7534053 | Optoelectronic housings and methods of assembling optoelectronic packages | — | 2009-05-19 |
| 7511616 | Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit | — | 2009-03-31 |
| 7425507 | Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structures | — | 2008-09-16 |
| 7405155 | Circuit package and method of plating the same | Xiaowei Yao, Tam Nguyen, Marc Finot, Jeffrey A. Bennett, Robert Kohler | 2008-07-29 |
| RE40137 | Methods for forming integrated circuits within substrates | Mark E. Tuttle | 2008-03-04 |
| 7223626 | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree | 2007-05-29 |
| 7199449 | Wafer backside removal to complete through-holes and provide wafer singulation during the formation of a semiconductor device | — | 2007-04-03 |