Issued Patents All Time
Showing 25 most recent of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394757 | Semiconductor devices with redistribution structures configured for switchable routing | Travis M. Jensen | 2025-08-19 |
| 12148727 | Semiconductor device assembly with die support structures | Brandon P. Wirz | 2024-11-19 |
| 11791316 | Semiconductor devices with redistribution structures configured for switchable routing | Travis M. Jensen | 2023-10-17 |
| 11776877 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2023-10-03 |
| 11329026 | Apparatuses and methods for internal heat spreading for packaged semiconductor die | — | 2022-05-10 |
| 11239095 | Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill | William R. Stephenson | 2022-02-01 |
| 11171121 | Semiconductor devices with redistribution structures configured for switchable routing | Travis M. Jensen | 2021-11-09 |
| 10923447 | Semiconductor device assembly with die support structures | Brandon P. Wirz | 2021-02-16 |
| 10461059 | Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods | Michel Koopmans, Shijian Luo | 2019-10-29 |
| 10424495 | Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill | William R. Stephenson | 2019-09-24 |
| 10163755 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2018-12-25 |
| 10068875 | Apparatuses and methods for heat transfer from packaged semiconductor die | — | 2018-09-04 |
| 10008395 | Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill | William R. Stephenson | 2018-06-26 |
| 9960148 | Methods for transferring heat from stacked microfeature devices | Salman Akram | 2018-05-01 |
| 9837396 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2017-12-05 |
| 9691746 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2017-06-27 |
| 9595504 | Methods and systems for releasably attaching support members to microfeature workpieces | David A. Pratt | 2017-03-14 |
| 9548286 | Solid state lights with thermal control elements | Scott E. Sills, David R. Jenkins | 2017-01-17 |
| 9443744 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2016-09-13 |
| 9269700 | Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods | Michel Koopmans, Shijian Luo | 2016-02-23 |
| 9165888 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Owen R. Fay, Warren M. Farnworth | 2015-10-20 |
| 9018751 | Semiconductor module system having encapsulated through wire interconnect (TWI) | Alan G. Wood | 2015-04-28 |
| 9013044 | Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact | Alan G. Wood | 2015-04-21 |
| 8999498 | Methods and systems for releasably attaching support members to microfeature workpieces | David A. Pratt | 2015-04-07 |
| 8982469 | Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same | Steve Oliver | 2015-03-17 |