Issued Patents All Time
Showing 26–50 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8741667 | Method for fabricating a through wire interconnect (TWI) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer | Alan G. Wood | 2014-06-03 |
| 8680654 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Owen R. Fay, Warren M. Farnworth | 2014-03-25 |
| 8669179 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, James M. Wark, Warren M. Farnworth +6 more | 2014-03-11 |
| 8581387 | Through wire interconnect (TWI) having bonded connection and encapsulating polymer layer | Alan G. Wood | 2013-11-12 |
| 8546931 | Stacked semiconductor components having conductive interconnects | Alan G. Wood, William M. Hiatt | 2013-10-01 |
| 8513797 | Stacked semiconductor component having through wire interconnect (TWI) with compressed wire | Alan G. Wood | 2013-08-20 |
| 8502353 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, James M. Wark, Warren M. Farnworth +6 more | 2013-08-06 |
| 8435836 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Owen R. Fay, Warren M. Farnworth | 2013-05-07 |
| 8404523 | Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI) | Alan G. Wood | 2013-03-26 |
| 8361604 | Methods and systems for releasably attaching support members to microfeature workpieces | David A. Pratt | 2013-01-29 |
| 8217510 | Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI) | Alan G. Wood | 2012-07-10 |
| 8193646 | Semiconductor component having through wire interconnect (TWI) with compressed wire | Alan G. Wood | 2012-06-05 |
| 8120167 | System with semiconductor components having encapsulated through wire interconnects (TWI) | Alan G. Wood | 2012-02-21 |
| 8111515 | Methods and apparatuses for transferring heat from stacked microfeature devices | Salman Akram | 2012-02-07 |
| 8053909 | Semiconductor component having through wire interconnect with compressed bump | — | 2011-11-08 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Peter Benson +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, James M. Wark, Warren M. Farnworth +6 more | 2011-06-07 |
| 7951702 | Methods for fabricating semiconductor components with conductive interconnects having planar surfaces | Alan G. Wood, William M. Hiatt | 2011-05-31 |
| 7935991 | Semiconductor components with conductive interconnects | Alan G. Wood, William M. Hiatt | 2011-05-03 |
| 7919846 | Stacked semiconductor component having through wire interconnect | — | 2011-04-05 |
| 7916396 | Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same | Steve Oliver | 2011-03-29 |
| 7883908 | Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI) | Alan G. Wood | 2011-02-08 |
| 7872332 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Owen R. Fay, Warren M. Farnworth | 2011-01-18 |
| 7833832 | Method of fabricating semiconductor components with through interconnects | Alan G. Wood, Warren M. Farnworth | 2010-11-16 |
| 7829976 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2010-11-09 |