| 10446440 |
Semiconductor devices comprising nickel— and copper—containing interconnects |
Salman Akram, William M. Hiatt |
2019-10-15 |
$10,153,000 |
| 10062608 |
Semiconductor devices comprising nickel- and copper-containing interconnects |
Salman Akram, William M. Hiatt |
2018-08-28 |
$23,018,000 |
| 9640433 |
Methods of forming interconnects and semiconductor structures |
Salman Akram, William M. Hiatt |
2017-05-02 |
$18,118,000 |
| 8669179 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, Warren M. Farnworth +6 more |
2014-03-11 |
$15,851,000 |
| 8647982 |
Methods of forming interconnects in a semiconductor structure |
Salman Akram, William M. Hiatt |
2014-02-11 |
$17,172,000 |
| 8502353 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, Warren M. Farnworth +6 more |
2013-08-06 |
$3,661,000 |
| 8324100 |
Methods of forming conductive vias |
Salman Akram, William M. Hiatt, Steven Oliver, Alan G. Wood, Sidney B. Rigg +1 more |
2012-12-04 |
$2,477,000 |
| 8294273 |
Methods for fabricating and filling conductive vias and conductive vias so formed |
Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, Sidney B. Rigg +1 more |
2012-10-23 |
$2,365,000 |
| 7993944 |
Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers |
Steven Oliver, Kyle K. Kirby |
2011-08-09 |
$2,316,000 |
| 7956443 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, Warren M. Farnworth +6 more |
2011-06-07 |
$3,124,000 |
| 7928579 |
Devices including sloped vias in a substrate and devices including spring-like deflecting contacts |
Syed Sajid Ahmad |
2011-04-19 |
$3,891,000 |
| 7892972 |
Methods for fabricating and filling conductive vias and conductive vias so formed |
Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, Sidney B. Rigg +1 more |
2011-02-22 |
$5,769,000 |
| 7855454 |
Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures |
Salman Akram, William M. Hiatt |
2010-12-21 |
$4,496,000 |
| 7812436 |
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
— |
2010-10-12 |
$3,573,000 |
| 7776652 |
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
— |
2010-08-17 |
$3,732,000 |
| 7730372 |
Device and method for testing integrated circuit dice in an integrated circuit module |
Warren M. Farnworth, Eric S. Nelson, Kevin G. Duesman |
2010-06-01 |
$3,541,000 |
| 7723741 |
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
Warren M. Farnworth, Alan G. Wood, David R. Hembree, Rickie C. Lake |
2010-05-25 |
|
| 7709776 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more |
2010-05-04 |
|
| 7683458 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, Warren M. Farnworth +6 more |
2010-03-23 |
$3,502,000 |
| 7589010 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same |
Warren M. Farnworth, Alan G. Wood, David R. Hembree, Syed Sajid Ahmad, Michael E. Hess +1 more |
2009-09-15 |
$6,722,000 |
| 7561938 |
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs |
Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more |
2009-07-14 |
$3,519,000 |
| 7519881 |
Device and method for testing integrated circuit dice in an integrated circuit module |
Warren M. Farnworth, Eric S. Nelson, Kevin G. Duesman |
2009-04-14 |
$2,483,000 |
| 7504615 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more |
2009-03-17 |
|
| 7498675 |
Semiconductor component having plate, stacked dice and conductive vias |
Warren M. Farnworth, Alan G. Wood, William M. Hiatt, David R. Hembree, Kyle K. Kirby +1 more |
2009-03-03 |
$1,946,000 |
| 7488899 |
Compliant contact pin assembly and card system |
Kyle K. Kirby, Warren M. Farnworth, William M. Hiatt, David R. Hembree, Alan G. Wood |
2009-02-10 |
$1,650,000 |
