Issued Patents All Time
Showing 25 most recent of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446440 | Semiconductor devices comprising nickel— and copper—containing interconnects | Salman Akram, William M. Hiatt | 2019-10-15 |
| 10062608 | Semiconductor devices comprising nickel- and copper-containing interconnects | Salman Akram, William M. Hiatt | 2018-08-28 |
| 9640433 | Methods of forming interconnects and semiconductor structures | Salman Akram, William M. Hiatt | 2017-05-02 |
| 8669179 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, Warren M. Farnworth +6 more | 2014-03-11 |
| 8647982 | Methods of forming interconnects in a semiconductor structure | Salman Akram, William M. Hiatt | 2014-02-11 |
| 8502353 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, Warren M. Farnworth +6 more | 2013-08-06 |
| 8324100 | Methods of forming conductive vias | Salman Akram, William M. Hiatt, Steven Oliver, Alan G. Wood, Sidney B. Rigg +1 more | 2012-12-04 |
| 8294273 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, Sidney B. Rigg +1 more | 2012-10-23 |
| 7993944 | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers | Steven Oliver, Kyle K. Kirby | 2011-08-09 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, Warren M. Farnworth +6 more | 2011-06-07 |
| 7928579 | Devices including sloped vias in a substrate and devices including spring-like deflecting contacts | Syed Sajid Ahmad | 2011-04-19 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, Sidney B. Rigg +1 more | 2011-02-22 |
| 7855454 | Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures | Salman Akram, William M. Hiatt | 2010-12-21 |
| 7812436 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2010-10-12 |
| 7776652 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2010-08-17 |
| 7730372 | Device and method for testing integrated circuit dice in an integrated circuit module | Warren M. Farnworth, Eric S. Nelson, Kevin G. Duesman | 2010-06-01 |
| 7723741 | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers | Warren M. Farnworth, Alan G. Wood, David R. Hembree, Rickie C. Lake | 2010-05-25 |
| 7709776 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2010-05-04 |
| 7683458 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, Warren M. Farnworth +6 more | 2010-03-23 |
| 7589010 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, Alan G. Wood, David R. Hembree, Syed Sajid Ahmad, Michael E. Hess +1 more | 2009-09-15 |
| 7561938 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2009-07-14 |
| 7519881 | Device and method for testing integrated circuit dice in an integrated circuit module | Warren M. Farnworth, Eric S. Nelson, Kevin G. Duesman | 2009-04-14 |
| 7504615 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2009-03-17 |
| 7498675 | Semiconductor component having plate, stacked dice and conductive vias | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, David R. Hembree, Kyle K. Kirby +1 more | 2009-03-03 |
| 7488899 | Compliant contact pin assembly and card system | Kyle K. Kirby, Warren M. Farnworth, William M. Hiatt, David R. Hembree, Alan G. Wood | 2009-02-10 |