Issued Patents All Time
Showing 26–50 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7459393 | Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, David R. Hembree, Kyle K. Kirby +1 more | 2008-12-02 |
| 7452743 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level | Steven Oliver, Lu Velicky, William M. Hiatt, David R. Hembree, Mark E. Tuttle +3 more | 2008-11-18 |
| 7429494 | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers | Steven Oliver, Kyle K. Kirby | 2008-09-30 |
| 7423338 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2008-09-09 |
| 7423339 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2008-09-09 |
| 7419841 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson +4 more | 2008-09-02 |
| 7411286 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2008-08-12 |
| 7402902 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2008-07-22 |
| 7394267 | Compliant contact pin assembly and card system | Kyle K. Kirby, Warren M. Farnworth, William M. Hiatt, David R. Hembree, Alan G. Wood | 2008-07-01 |
| 7390740 | Sloped vias in a substrate, spring-like contacts, and methods of making | Syed Sajid Ahmad | 2008-06-24 |
| 7358751 | Contact pin assembly and contactor card | Kyle K. Kirby, Warren M. Farnworth, William M. Hiatt, David R. Hembree, Alan G. Wood | 2008-04-15 |
| 7300857 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, Warren M. Farnworth +6 more | 2007-11-27 |
| 7297563 | Method of making contact pin card system | Kyle K. Kirby, Warren M. Farnworth, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-11-20 |
| 7288954 | Compliant contact pin test assembly and methods thereof | Kyle K. Kirby, Warren M. Farnworth, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-10-30 |
| 7287326 | Methods of forming a contact pin assembly | Kyle K. Kirby, Warren M. Farnworth, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-10-30 |
| 7282932 | Compliant contact pin assembly, card system and methods thereof | Kyle K. Kirby, Warren M. Farnworth, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-10-16 |
| 7282792 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2007-10-16 |
| 7279407 | Selective nickel plating of aluminum, copper, and tungsten structures | Salman Akram, William M. Hiatt | 2007-10-09 |
| 7265330 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2007-09-04 |
| 7224051 | Semiconductor component having plate and stacked dice | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, David R. Hembree, Kyle K. Kirby +1 more | 2007-05-29 |
| 7223626 | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers | Warren M. Farnworth, Alan G. Wood, David R. Hembree, Rickie C. Lake | 2007-05-29 |
| 7205661 | Projected contact structures for engaging bumped semiconductor devices and methods of making the same | Salman Akram | 2007-04-17 |
| 7199439 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson +4 more | 2007-04-03 |
| 7189954 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2007-03-13 |
| 7166915 | Multi-chip module system | Salman Akram, David R. Hembree | 2007-01-23 |