Issued Patents All Time
Showing 76–100 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6687989 | Method for fabricating interconnect having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, John O. Jacobson, Salman Akram | 2004-02-10 |
| 6655535 | Methods for facilitating circuit board processing | Michael J. Bettinger | 2003-12-02 |
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2003-11-04 |
| 6630837 | Apparatus for testing bumped die | — | 2003-10-07 |
| 6617684 | Packaged die on PCB with heat sink encapsulant | Salman Akram | 2003-09-09 |
| 6613662 | Method for making projected contact structures for engaging bumped semiconductor devices | Salman Akram | 2003-09-02 |
| 6605489 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2003-08-12 |
| 6605956 | Device and method for testing integrated circuit dice in an integrated circuit module | Warren M. Farnworth, Eric S. Nelson, Kevin G. Duesman | 2003-08-12 |
| 6600334 | Force applying probe card and test system for semiconductor wafers | David R. Hembree, Warren M. Farnworth | 2003-07-29 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2003-04-22 |
| 6544461 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2003-04-08 |
| 6534858 | Assembly and methods for packaged die on pcb with heat sink encapsulant | Salman Akram | 2003-03-18 |
| 6531772 | Electronic system including memory module with redundant memory capability | Salman Akram, David R. Hembree | 2003-03-11 |
| 6492187 | Method for automatically positioning electronic die within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, Jennifer L. Folaron +3 more | 2002-12-10 |
| 6486552 | Method and apparatus for testing bumped die | — | 2002-11-26 |
| 6472894 | Apparatus for testing bumped die | — | 2002-10-29 |
| 6464124 | Electrically conductive elevation shaping tool | — | 2002-10-15 |
| 6455933 | Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of flip chip | Salman Akram | 2002-09-24 |
| 6420892 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, David R. Hembree, Salman Akram, John O. Jacobson | 2002-07-16 |
| 6419844 | Method for fabricating calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, David R. Hembree, Salman Akram, John O. Jacobson | 2002-07-16 |
| 6411118 | Method and apparatus for testing bumped die | — | 2002-06-25 |
| 6407570 | Interconnect for testing semiconductor components having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, John O. Jacobson, Salman Akram | 2002-06-18 |
| 6399416 | Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2002-06-04 |
| 6398043 | Apparatus and method for facilitating circuit board processing | Michael J. Bettinger | 2002-06-04 |
| 6395565 | Multi-chip module system and method of fabrication | Salman Akram, David R. Hembree | 2002-05-28 |