Issued Patents All Time
Showing 25 most recent of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7589010 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Syed Sajid Ahmad +1 more | 2009-09-15 |
| 7561938 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2009-07-14 |
| 7155300 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2006-12-26 |
| 7120513 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2006-10-10 |
| 7105380 | Method of temporarily securing a die to a burn-in carrier | Walter L. Moden | 2006-09-12 |
| 7012811 | Method of tuning a multi-path circuit | Tongbi Jiang, Alan G. Wood | 2006-03-14 |
| 6998334 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Syed Sajid Ahmad +1 more | 2006-02-14 |
| 6900459 | Apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2005-05-31 |
| 6894521 | Burn-in carrier for a semiconductor die | Walter L. Moden | 2005-05-17 |
| 6851597 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, Warren M. Farnworth, Alan G. Wood | 2005-02-08 |
| 6713879 | Semiconductor substract with substantially matched lines | Salman Akram | 2004-03-30 |
| 6703714 | Methods for fabricating flip-chip devices and preventing coupling between signal interconnections | Salman Akram | 2004-03-09 |
| 6687989 | Method for fabricating interconnect having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, James M. Wark, Salman Akram | 2004-02-10 |
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2003-11-04 |
| 6627999 | Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps | Salman Akram | 2003-09-30 |
| 6619532 | Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, Warren M. Farnworth, Alan G. Wood | 2003-09-16 |
| 6551845 | Method of temporarily securing a die to a burn-in carrier | Walter L. Moden | 2003-04-22 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2003-04-22 |
| 6544461 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2003-04-08 |
| 6538463 | Semiconductor die and retaining fixture | Walter L. Moden | 2003-03-25 |
| 6492187 | Method for automatically positioning electronic die within component packages | Warren M. Farnworth, Alan G. Wood, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2002-12-10 |
| 6462423 | Flip-chip with matched lines and ground plane | Salman Akram | 2002-10-08 |
| 6427899 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, Warren M. Farnworth, Alan G. Wood | 2002-08-06 |
| 6419143 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, Warren M. Farnworth, Alan G. Wood | 2002-07-16 |
| 6419844 | Method for fabricating calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, David R. Hembree, Salman Akram, James M. Wark | 2002-07-16 |