Issued Patents All Time
Showing 1–25 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450577 | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces | Tom A. Muntifering, Paul J. Clawson | 2022-09-20 |
| 11075146 | Microfeature workpieces having alloyed conductive structures, and associated methods | Rick Lake, William M. Hiatt | 2021-07-27 |
| 10541192 | Microfeature workpieces having alloyed conductive structures, and associated methods | Rick Lake, William M. Hiatt | 2020-01-21 |
| 9737947 | Microfeature workpieces having alloyed conductive structures, and associated methods | Rickie C. Lake, William M. Hiatt | 2017-08-22 |
| 9579825 | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces | Tom A. Muntifering, Paul J. Clawson | 2017-02-28 |
| 9337162 | Multi-component integrated circuit contacts | William M. Hiatt | 2016-05-10 |
| 9165888 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Owen R. Fay, David R. Hembree | 2015-10-20 |
| 8963292 | Semiconductor device having backside redistribution layers and method for fabricating the same | Steve Oliver | 2015-02-24 |
| 8951858 | Imager device with electric connections to electrical device | — | 2015-02-10 |
| 8929052 | Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Dewali Ray, Kyle K. Kirby | 2015-01-06 |
| 8896105 | Microelectronic devices and methods for manufacturing microelectronic devices | Kristy A. Campbell | 2014-11-25 |
| 8816463 | Wafer-level packaged microelectronic imagers having interconnects formed through terminals | Salman Akram, Peter Benson, William M. Hiatt | 2014-08-26 |
| 8786097 | Method of forming vias in semiconductor substrates and resulting structures | Charles M. Watkins, Kyle K. Kirby, Alan G. Wood, Salman Akram | 2014-07-22 |
| 8704380 | Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods | Alan G. Wood | 2014-04-22 |
| 8680680 | Semiconductor devices including porous insulators | Tongbi Jiang | 2014-03-25 |
| 8680654 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Owen R. Fay, David R. Hembree | 2014-03-25 |
| 8669179 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2014-03-11 |
| 8637994 | Microfeature workpieces having alloyed conductive structures, and associated methods | Rick Lake, William M. Hiatt | 2014-01-28 |
| 8597074 | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces | Tom A. Muntifering, Paul J. Clawson | 2013-12-03 |
| 8592254 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, William M. Hiatt, Nishant Sinha | 2013-11-26 |
| 8569093 | Microelectronic devices and methods for manufacturing microelectronic devices | Kristy A. Campbell | 2013-10-29 |
| 8513113 | Methods of forming semiconductor constructions and assemblies | Steven Oliver | 2013-08-20 |
| 8503156 | Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto | Dewali Ray, Kyle K. Kirby | 2013-08-06 |
| 8502353 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2013-08-06 |
| 8440491 | Methods of forming imager device with electric connections to electrical device | — | 2013-05-14 |