Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450577 | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces | Warren M. Farnworth, Tom A. Muntifering | 2022-09-20 |
| 9579825 | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces | Warren M. Farnworth, Tom A. Muntifering | 2017-02-28 |
| 8597074 | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces | Warren M. Farnworth, Tom A. Muntifering | 2013-12-03 |
| 8053279 | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces | Warren M. Farnworth, Tom A. Muntifering | 2011-11-08 |
| 7825010 | Die singulation methods | — | 2010-11-02 |