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Dual junction box for a photovoltaic device |
Michael Bauer, Julia Crutcher, Casimir Kotarba, Anthony Maher, Christina Moffett +1 more |
2024-11-19 |
| D944724 |
Photovoltaic device |
Joshua Conley, Benjamin C. de Fresart, Peter Hruby, Matthew Kuzila, Weixin Li +3 more |
2022-03-01 |
| D943507 |
Photovoltaic device |
Joshua Conley, Benjamin C. de Fresart, Peter Hruby, Matthew Kuzila, Weixin Li +3 more |
2022-02-15 |
| D848362 |
Photovoltaic device |
Joshua Conley, Benjamin C. de Fresart, Peter Hruby, Matthew Kuzila, Weixin Li +3 more |
2019-05-14 |
| 9054099 |
Semiconductor device with copper wirebond sites and methods of making same |
— |
2015-06-09 |
| 8592254 |
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
Warren M. Farnworth, William M. Hiatt, Nishant Sinha |
2013-11-26 |
| 8569161 |
Semiconductor device with copper wirebond sites and methods of making same |
— |
2013-10-29 |
| 8431484 |
Stable electroless fine pitch interconnect plating |
— |
2013-04-30 |
| 8291966 |
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
Warren M. Farnworth, William M. Hiatt, Nishant Sinha |
2012-10-23 |
| 7939949 |
Semiconductor device with copper wirebond sites and methods of making same |
— |
2011-05-10 |
| 7485565 |
Nickel bonding cap over copper metalized bondpads |
Jeffery N. Gleason |
2009-02-03 |
| 7312164 |
Selective passivation of exposed silicon |
— |
2007-12-25 |
| 7256115 |
Asymmetric plating |
Warren M. Farnworth |
2007-08-14 |
| 7190052 |
Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material |
— |
2007-03-13 |
| 7186636 |
Nickel bonding cap over copper metalized bondpads |
Jeffery N. Gleason |
2007-03-06 |
| 7183133 |
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
Warren M. Farnworth, William M. Hiatt, Nishant Sinha |
2007-02-27 |
| 7067924 |
Nickel bonding cap over copper metalized bondpads |
Jeffery N. Gleason |
2006-06-27 |
| 7052922 |
Stable electroless fine pitch interconnect plating |
— |
2006-05-30 |
| 6905953 |
Selective passivation of exposed silicon |
— |
2005-06-14 |
| 6825564 |
Nickel bonding cap over copper metalized bondpads |
Jeffery N. Gleason |
2004-11-30 |
| 6767817 |
Asymmetric plating |
Warren M. Farnworth |
2004-07-27 |
| 6710442 |
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
Warren M. Farnworth, William M. Hiatt, Nishant Sinha |
2004-03-23 |
| 6593221 |
Selective passivation of exposed silicon |
— |
2003-07-15 |
