Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7687879 | Intermediate semiconductor device structure | — | 2010-03-30 |
| 7485565 | Nickel bonding cap over copper metalized bondpads | Joseph T. Lindgren | 2009-02-03 |
| 7186636 | Nickel bonding cap over copper metalized bondpads | Joseph T. Lindgren | 2007-03-06 |
| 7067924 | Nickel bonding cap over copper metalized bondpads | Joseph T. Lindgren | 2006-06-27 |
| 6825564 | Nickel bonding cap over copper metalized bondpads | Joseph T. Lindgren | 2004-11-30 |