Issued Patents All Time
Showing 25 most recent of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12014958 | Microfeature workpieces and methods for forming interconnects in microfeature workpieces | Ross S. Dando | 2024-06-18 |
| 11476160 | Microfeature workpieces and methods for forming interconnects in microfeature workpieces | Ross S. Dando | 2022-10-18 |
| 11177175 | Microelectronic devices and methods for filling vias in microelectronic devices | Kyle K. Kirby | 2021-11-16 |
| 11075146 | Microfeature workpieces having alloyed conductive structures, and associated methods | Warren M. Farnworth, Rick Lake | 2021-07-27 |
| 10541192 | Microfeature workpieces having alloyed conductive structures, and associated methods | Warren M. Farnworth, Rick Lake | 2020-01-21 |
| 10446440 | Semiconductor devices comprising nickel— and copper—containing interconnects | Salman Akram, James M. Wark | 2019-10-15 |
| 10062608 | Semiconductor devices comprising nickel- and copper-containing interconnects | Salman Akram, James M. Wark | 2018-08-28 |
| 10010977 | Systems and methods for forming apertures in microfeature workpieces | Charles M. Watkins | 2018-07-03 |
| 9737947 | Microfeature workpieces having alloyed conductive structures, and associated methods | Warren M. Farnworth, Rickie C. Lake | 2017-08-22 |
| 9653420 | Microelectronic devices and methods for filling vias in microelectronic devices | Kyle K. Kirby | 2017-05-16 |
| 9640433 | Methods of forming interconnects and semiconductor structures | Salman Akram, James M. Wark | 2017-05-02 |
| 9607930 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, Kyle K. Kirby | 2017-03-28 |
| 9452492 | Systems and methods for forming apertures in microfeature workpieces | Charles M. Watkins | 2016-09-27 |
| 9343368 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, Kyle K. Kirby | 2016-05-17 |
| 9337162 | Multi-component integrated circuit contacts | Warren M. Farnworth | 2016-05-10 |
| 8816463 | Wafer-level packaged microelectronic imagers having interconnects formed through terminals | Salman Akram, Peter Benson, Warren M. Farnworth | 2014-08-26 |
| 8772086 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, Kyle K. Kirby | 2014-07-08 |
| 8748311 | Microelectronic devices and methods for filing vias in microelectronic devices | Kyle K. Kirby | 2014-06-10 |
| 8703518 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Kyle K. Kirby, Salman Akram | 2014-04-22 |
| 8686313 | System and methods for forming apertures in microfeature workpieces | Charles M. Watkins | 2014-04-01 |
| 8669179 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2014-03-11 |
| 8664562 | Systems and methods for forming apertures in microfeature workpieces | Charles M. Watkins | 2014-03-04 |
| 8647982 | Methods of forming interconnects in a semiconductor structure | Salman Akram, James M. Wark | 2014-02-11 |
| 8637994 | Microfeature workpieces having alloyed conductive structures, and associated methods | Warren M. Farnworth, Rick Lake | 2014-01-28 |
| 8592254 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, Warren M. Farnworth, Nishant Sinha | 2013-11-26 |