Issued Patents All Time
Showing 51–75 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7727872 | Methods for fabricating semiconductor components with conductive interconnects | Alan G. Wood, David R. Hembree | 2010-06-01 |
| 7719120 | Multi-component integrated circuit contacts | Warren M. Farnworth | 2010-05-18 |
| 7713841 | Methods for thinning semiconductor substrates that employ support structures formed on the substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, Peter Benson +2 more | 2010-05-11 |
| 7709776 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, Alan G. Wood, Peter Benson, James M. Wark +4 more | 2010-05-04 |
| 7683458 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2010-03-23 |
| 7632713 | Methods of packaging microelectronic imaging devices | Warren M. Farnworth | 2009-12-15 |
| 7603772 | Methods of fabricating substrates including one or more conductive vias | Warren M. Farnworth, Steven M. McDonald, Nishant Sinha | 2009-10-20 |
| 7594322 | Methods of fabricating substrates including at least one conductive via | Warren M. Farnworth, Steven M. McDonald, Nishant Sinha | 2009-09-29 |
| 7589426 | Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom | Tongbi Jiang, Li Li | 2009-09-15 |
| 7583862 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Mark E. Tuttle | 2009-09-01 |
| 7531453 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, David R. Hembree, Sidney B. Rigg, Warren M. Farnworth | 2009-05-12 |
| 7504615 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, Alan G. Wood, Peter Benson, James M. Wark +4 more | 2009-03-17 |
| 7502058 | Imager with tuned color filter | Ulrich Boettiger, Jeffrey McKee | 2009-03-10 |
| 7498647 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Kyle K. Kirby, Salman Akram | 2009-03-03 |
| 7498240 | Microfeature workpieces, carriers, and associated methods | Charles M. Watkins | 2009-03-03 |
| 7498258 | Through-hole conductors for semiconductor substrates and method for making same | — | 2009-03-03 |
| 7498260 | Pass through via technology for use during the manufacture of a semiconductor device | — | 2009-03-03 |
| 7498675 | Semiconductor component having plate, stacked dice and conductive vias | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2009-03-03 |
| 7494925 | Method for making through-hole conductors for semiconductor substrates | — | 2009-02-24 |
| 7488899 | Compliant contact pin assembly and card system | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, David R. Hembree, Alan G. Wood | 2009-02-10 |
| 7470563 | Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages | Warren M. Farnworth | 2008-12-30 |
| 7459393 | Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2008-12-02 |
| 7452743 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level | Steven Oliver, Lu Velicky, David R. Hembree, Mark E. Tuttle, Sidney B. Rigg +3 more | 2008-11-18 |
| 7446028 | Multi-component integrated circuit contacts | Warren M. Farnworth | 2008-11-04 |
| 7425499 | Methods for forming interconnects in vias and microelectronic workpieces including such interconnects | Steven Oliver, Kyle K. Kirby | 2008-09-16 |