Issued Patents All Time
Showing 101–118 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7199050 | Pass through via technology for use during the manufacture of a semiconductor device | — | 2007-04-03 |
| 7189954 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, Alan G. Wood, Peter Benson, James M. Wark +4 more | 2007-03-13 |
| 7183133 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, Warren M. Farnworth, Nishant Sinha | 2007-02-27 |
| 7148715 | Systems and methods for testing microelectronic imagers and microfeature devices | Salman Akram, Alan G. Wood, Charles M. Watkins, Kyle K. Kirby | 2006-12-12 |
| 7129573 | System having semiconductor component with encapsulated, bonded, interconnect contacts | Warren M. Farnworth, Charles M. Watkins, Nishant Sinha | 2006-10-31 |
| 7115998 | Multi-component integrated circuit contacts | Warren M. Farnworth | 2006-10-03 |
| 7094117 | Electrical contacts with dielectric cores | Warren M. Farnworth, Charles M. Watkins | 2006-08-22 |
| 7087995 | Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages | Warren M. Farnworth | 2006-08-08 |
| 7064010 | Methods of coating and singulating wafers | Warren M. Farnworth, Kyle K. Kirby | 2006-06-20 |
| 7060526 | Wafer level methods for fabricating multi-dice chip scale semiconductor components | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2006-06-13 |
| 6998717 | Multi-dice chip scale semiconductor components | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2006-02-14 |
| 6906418 | Semiconductor component having encapsulated, bonded, interconnect contacts | Warren M. Farnworth, Charles M. Watkins, Nishant Sinha | 2005-06-14 |
| 6841883 | Multi-dice chip scale semiconductor components and wafer level methods of fabrication | Warren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2005-01-11 |
| 6803303 | Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts | Warren M. Farnworth, Charles M. Watkins, Nishant Sinha | 2004-10-12 |
| 6710442 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, Warren M. Farnworth, Nishant Sinha | 2004-03-23 |
| 6673649 | Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages | Warren M. Farnworth | 2004-01-06 |
| 6663340 | Wafer carrier transport system for tool bays | Jason Zeakes, Clinton Haris, Karl Mautz | 2003-12-16 |
| 5963315 | Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection | Barbara Vasquez, Karl Mautz | 1999-10-05 |