Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6914006 | Wafer scribing method and wafer scribing device | Martin Peiter, Eckhard Marx | 2005-07-05 |
| 6902986 | Method for defining alignment marks in a semiconductor wafer | John Maltabes, Alain Charles, Joseph Petrucci | 2005-06-07 |
| 6895294 | Assembly comprising a plurality of mask containers, manufacturing system for manufacturing semiconductor devices, and method | Alain Charles, John Maltabes, Ralf Schuster | 2005-05-17 |
| 6892108 | Method for adjusting processing parameters of at least one plate-shaped object in a processing tool | Sebastian Schmidt, Thorsten Schedel | 2005-05-10 |
| 6881264 | Configuration and a method for reducing contamination with particles on a substrate in a process tool | Mark Hiatt, Ralf Schuster | 2005-04-19 |
| 6817602 | Manufacturing system method for processing a lithography mask container | Alain Charles, John Maltabes | 2004-11-16 |
| 6801322 | Method and apparatus for IN SITU measuring a required feature of a layer during a polishing process | — | 2004-10-05 |
| 6759248 | Semiconductor wafer identification | Jason Zeakes | 2004-07-06 |
| 6744494 | Continuously adjustable neutral density area filter | John Maltabes, Alain Charles | 2004-06-01 |
| 6737205 | Arrangement and method for transferring a pattern from a mask to a wafer | John Maltabes, Alain Charles | 2004-05-18 |
| 6709312 | Method and apparatus for monitoring a polishing condition of a surface of a wafer in a polishing process | — | 2004-03-23 |
| 6686254 | Semiconductor structure and method for reducing charge damage | Joseph Petrucci, John Maltabes, Alain Charles | 2004-02-03 |
| 6671059 | Method and system for determining a thickness of a layer | Larry E. Frisa | 2003-12-30 |
| 6663340 | Wafer carrier transport system for tool bays | Jason Zeakes, Clinton Haris, William M. Hiatt | 2003-12-16 |
| 6650135 | Measurement chuck having piezoelectric elements and method | John Maltabes, Alain Charles | 2003-11-18 |
| 6620563 | Lithography method for forming semiconductor devices on a wafer utilizing atomic force microscopy | John Maltabes, Alain Charles | 2003-09-16 |
| 6593254 | Method for clamping a semiconductor device in a manufacturing process | Manfred Kraxenberger, Ines Thümmel, Bruno Spuler, Thorsten Schedel | 2003-07-15 |
| 6589099 | Method for chemical mechanical polishing (CMP) with altering the concentration of oxidizing agent in slurry | David Weston Haggart, Jr., John Maltabes | 2003-07-08 |
| 6495802 | Temperature-controlled chuck and method for controlling the temperature of a substantially flat object | John Maltabes, Alain Charles | 2002-12-17 |
| 6472237 | Method and system for determining a thickness of a layer | Larry E. Frisa | 2002-10-29 |
| 6420098 | Method and system for manufacturing semiconductor devices on a wafer | — | 2002-07-16 |
| 6362098 | Plasma-enhanced chemical vapor deposition (CVD) method to fill a trench in a semiconductor substrate | Terry A. Breeden, Iraj Shahvandi, Michael Tucker, Olivier Vatel, Ralf Zedlitz | 2002-03-26 |
| 6313567 | Lithography chuck having piezoelectric elements, and method | John Maltabes, Alain Charles | 2001-11-06 |
| 5982166 | Method for measuring a characteristic of a semiconductor wafer using cylindrical control | — | 1999-11-09 |
| 5966635 | Method for reducing particles on a substrate using chuck cleaning | W. Mark Hiatt | 1999-10-12 |