Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11537039 | Photomask assembly with reflective photomask and method of manufacturing a reflective photomask | Markus Bender, Andreas Schenke | 2022-12-27 |
| 10031409 | Reflective photomask and reflection-type mask blank | Markus Bender | 2018-07-24 |
| 8097955 | Interconnect structures and methods | Bernd Zimmermann, Volker Berghof, Stefan Ruckmich | 2012-01-17 |
| 7304716 | Method for purging an optical lens | Sebastian Schmidt, Gunter Hraschan | 2007-12-04 |
| 7248365 | Method for adjusting a substrate in an appliance for carrying out exposure | Martin Rössiger | 2007-07-24 |
| 7186484 | Method for determining the relative positional accuracy of two structure elements on a wafer | Heiko Hommen, Jens Stäcker, Maria de la Piedad Fernandez-Martinez, Jens Uwe Bruch | 2007-03-06 |
| 6979522 | Method for exposing at least one or at least two semiconductor wafers | Heiko Hommen, Ralf Otto, Sebastian Schmidt, Thomas Fischer | 2005-12-27 |
| 6908775 | Method for performing an alignment measurement of two patterns in different layers on a semiconductor wafer | Rolf Heine, Sebastian Schmidt | 2005-06-21 |
| 6892108 | Method for adjusting processing parameters of at least one plate-shaped object in a processing tool | Karl Mautz, Sebastian Schmidt | 2005-05-10 |
| 6887722 | Method for exposing a semiconductor wafer | Torsten Seidel | 2005-05-03 |
| 6861331 | Method for aligning and exposing a semiconductor wafer | Martin Rössiger, Jens Stäcker | 2005-03-01 |
| 6806008 | Method for adjusting a temperature in a resist process | Torsten Seidel | 2004-10-19 |
| 6780552 | Method for controlling the quality of a lithographic structuring step | Jens Zimmermann, Sebastian Schmidt | 2004-08-24 |
| 6684124 | Method for controlling a processing device for a sequential processing of semiconductor wafers | Karl-Heinz Schumacher, Thomas Fischer, Heiko Hommen, Ralf Otto, Sebastian Schmidt | 2004-01-27 |
| 6593254 | Method for clamping a semiconductor device in a manufacturing process | Manfred Kraxenberger, Ines Thümmel, Bruno Spuler, Karl Mautz | 2003-07-15 |