Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6593238 | Method for determining an endpoint and semiconductor wafer | Walter Glashauser | 2003-07-15 |
| 6589099 | Method for chemical mechanical polishing (CMP) with altering the concentration of oxidizing agent in slurry | John Maltabes, Karl Mautz | 2003-07-08 |
| 6375549 | Polishing head for wafer, and method for polishing | Walter Glashauser, Lutz Teichgräber, Katrin Ebner | 2002-04-23 |