Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8343842 | Method for reducing plasma discharge damage during processing | David M. Schraub, James D. Legg, Mehul D. Shroff, Ruiqi Tian | 2013-01-01 |
| 7951695 | Method for reducing plasma discharge damage during processing | David M. Schraub, James D. Legg, Mehul D. Shroff, Ruiqi Tian | 2011-05-31 |
| 6663674 | Method of handling a silicon wafer | Michael Tucker, Stefan Ottow, Wolfram Kostler, Dan Wissel | 2003-12-16 |
| 6362098 | Plasma-enhanced chemical vapor deposition (CVD) method to fill a trench in a semiconductor substrate | Iraj Shahvandi, Michael Tucker, Olivier Vatel, Karl Mautz, Ralf Zedlitz | 2002-03-26 |