Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8669179 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2014-03-11 |
| 8637962 | Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate | Salman Akram | 2014-01-28 |
| 8502353 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2013-08-06 |
| 8324101 | Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate | Salman Akram | 2012-12-04 |
| 8324100 | Methods of forming conductive vias | Salman Akram, William M. Hiatt, Steven Oliver, Alan G. Wood, James M. Wark +1 more | 2012-12-04 |
| 8294273 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, James M. Wark +1 more | 2012-10-23 |
| 7989345 | Methods of forming blind wafer interconnects, and related structures and assemblies | Salman Akram | 2011-08-02 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, William M. Hiatt, Peter Benson +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2011-06-07 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, James M. Wark +1 more | 2011-02-22 |
| 7829976 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, David R. Hembree, Warren M. Farnworth, William M. Hiatt | 2010-11-09 |
| 7772116 | Methods of forming blind wafer interconnects | Salman Akram | 2010-08-10 |
| 7759800 | Microelectronics devices, having vias, and packaged microelectronic devices having vias | Charles M. Watkins, Kyle K. Kirby, Peter Benson, Salman Akram | 2010-07-20 |
| 7713841 | Methods for thinning semiconductor substrates that employ support structures formed on the substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, William M. Hiatt, Peter Benson +2 more | 2010-05-11 |
| 7709776 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, William M. Hiatt, Alan G. Wood, Peter Benson, James M. Wark +4 more | 2010-05-04 |
| 7683458 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2010-03-23 |
| 7531453 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, David R. Hembree, Warren M. Farnworth, William M. Hiatt | 2009-05-12 |
| 7504615 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, William M. Hiatt, Alan G. Wood, Peter Benson, James M. Wark +4 more | 2009-03-17 |
| 7452743 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level | Steven Oliver, Lu Velicky, William M. Hiatt, David R. Hembree, Mark E. Tuttle +3 more | 2008-11-18 |
| 7419841 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, William M. Hiatt, Kyle K. Kirby, Peter Benson, James M. Wark +4 more | 2008-09-02 |
| 7413979 | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices | Charles M. Watkins, Kyle K. Kirby, Peter Benson, Salman Akram | 2008-08-19 |
| 7329943 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, David R. Hembree, Warren M. Farnworth, William M. Hiatt | 2008-02-12 |
| 7300857 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2007-11-27 |
| 7265330 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, William M. Hiatt, Alan G. Wood, Peter Benson, James M. Wark +4 more | 2007-09-04 |
| 7262405 | Prefabricated housings for microelectronic imagers | Warren M. Farnworth, David R. Hembree, William M. Hiatt | 2007-08-28 |