| 8669179 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more |
2014-03-11 |
$15,851,000 |
| 8637962 |
Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate |
Salman Akram |
2014-01-28 |
$9,409,000 |
| 8502353 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more |
2013-08-06 |
$3,661,000 |
| 8324101 |
Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate |
Salman Akram |
2012-12-04 |
$2,477,000 |
| 8324100 |
Methods of forming conductive vias |
Salman Akram, William M. Hiatt, Steven Oliver, Alan G. Wood, James M. Wark +1 more |
2012-12-04 |
$2,477,000 |
| 8294273 |
Methods for fabricating and filling conductive vias and conductive vias so formed |
Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, James M. Wark +1 more |
2012-10-23 |
$2,365,000 |
| 7989345 |
Methods of forming blind wafer interconnects, and related structures and assemblies |
Salman Akram |
2011-08-02 |
$1,985,000 |
| 7960829 |
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates |
Alan G. Wood, Warren M. Farnworth, David R. Hembree, William M. Hiatt, Peter Benson +2 more |
2011-06-14 |
$3,660,000 |
| 7956443 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more |
2011-06-07 |
$3,124,000 |
| 7892972 |
Methods for fabricating and filling conductive vias and conductive vias so formed |
Salman Akram, William M. Hiatt, Steve Oliver, Alan G. Wood, James M. Wark +1 more |
2011-02-22 |
$5,769,000 |
| 7829976 |
Microelectronic devices and methods for forming interconnects in microelectronic devices |
Kyle K. Kirby, Salman Akram, David R. Hembree, Warren M. Farnworth, William M. Hiatt |
2010-11-09 |
$3,205,000 |
| 7772116 |
Methods of forming blind wafer interconnects |
Salman Akram |
2010-08-10 |
$2,948,000 |
| 7759800 |
Microelectronics devices, having vias, and packaged microelectronic devices having vias |
Charles M. Watkins, Kyle K. Kirby, Peter Benson, Salman Akram |
2010-07-20 |
$2,641,000 |
| 7713841 |
Methods for thinning semiconductor substrates that employ support structures formed on the substrates |
Alan G. Wood, Warren M. Farnworth, David R. Hembree, William M. Hiatt, Peter Benson +2 more |
2010-05-11 |
$4,723,000 |
| 7709776 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
Warren M. Farnworth, William M. Hiatt, Alan G. Wood, Peter Benson, James M. Wark +4 more |
2010-05-04 |
|
| 7683458 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more |
2010-03-23 |
$3,502,000 |
| 7531453 |
Microelectronic devices and methods for forming interconnects in microelectronic devices |
Kyle K. Kirby, Salman Akram, David R. Hembree, Warren M. Farnworth, William M. Hiatt |
2009-05-12 |
$4,144,000 |
| 7504615 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
Warren M. Farnworth, William M. Hiatt, Alan G. Wood, Peter Benson, James M. Wark +4 more |
2009-03-17 |
|
| 7452743 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level |
Steven Oliver, Lu Velicky, William M. Hiatt, David R. Hembree, Mark E. Tuttle +3 more |
2008-11-18 |
|
| 7419841 |
Microelectronic imagers and methods of packaging microelectronic imagers |
Warren M. Farnworth, William M. Hiatt, Kyle K. Kirby, Peter Benson, James M. Wark +4 more |
2008-09-02 |
$1,912,000 |
| 7413979 |
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices |
Charles M. Watkins, Kyle K. Kirby, Peter Benson, Salman Akram |
2008-08-19 |
$1,561,000 |
| 7329943 |
Microelectronic devices and methods for forming interconnects in microelectronic devices |
Kyle K. Kirby, Salman Akram, David R. Hembree, Warren M. Farnworth, William M. Hiatt |
2008-02-12 |
$1,579,000 |
| 7300857 |
Through-wafer interconnects for photoimager and memory wafers |
Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more |
2007-11-27 |
$3,989,000 |
| 7265330 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
Warren M. Farnworth, William M. Hiatt, Alan G. Wood, Peter Benson, James M. Wark +4 more |
2007-09-04 |
$3,143,000 |
| 7262405 |
Prefabricated housings for microelectronic imagers |
Warren M. Farnworth, David R. Hembree, William M. Hiatt |
2007-08-28 |
$1,732,000 |
