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Home › Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate

Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate

US Patent 8324101 · Granted Dec 4, 2012

Estimated economic value: $2,477,000 ⓘ

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