Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic devices and methods for forming interconnects in microelectronic devices

Microelectronic devices and methods for forming interconnects in microelectronic devices

US Patent 7531453 · Granted May 12, 2009

Estimated economic value: $4,144,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Golf putter2025
Semiconductor interconnect structures with vertically offset bonding surfaces, a2025
Systems and methods for direct bonding in semiconductor die manufacturing2025
Monolithic conductive column in a semiconductor device and associated methods2025
Monolithic conductive cylinder in a semiconductor device and associated methods2025
Semiconductor devices with redistribution structures configured for switchable r2025
Front end of line interconnect structures and associated systems and methods2025
Microelectronic devices with through-substrate interconnects and associated meth2025
Embedded nanoparticles for on-die thermal enhancement of hybrid bonding and asso2025
Front end of line interconnect structures and associated systems and methods2025
Piezoelectric materials for on-die thermal enhancement of hybrid bonding and ass2025
Multi-height interconnect structures and associated systems and methods2025