Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate

Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate

US Patent 8637962 · Granted Jan 28, 2014

Estimated economic value: $9,409,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of bonding a semiconductor device to a support substrate2023
Elevated pocket pixels, imaging devices and systems including the same and metho2023
Chip scale light emitting device package with dome2021
Elevated pocket pixels, imaging devices and systems including the same and metho2021
Laser de-bond carrier wafer from device wafer2020
Elevated pocket pixels, imaging devices and systems including the same and metho2019
Hybrid gate dielectrics for semiconductor power devices2019
Semiconductor devices comprising nickel— and copper—containing interconnects2019
Elevated pocket pixels, imaging devices and systems including the same and metho2019
Semiconductor devices comprising nickel- and copper-containing interconnects2018
LED with stress-buffer layer under metallization layer2018
Hybrid gate dielectrics for semiconductor power devices2018