Issued Patents All Time
Showing 25 most recent of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121738 | Semiconductor constructions | Philip J. Ireland | 2018-11-06 |
| 9583419 | Semiconductor constructions having through-substrate interconnects | Philip J. Ireland | 2017-02-28 |
| 9018751 | Semiconductor module system having encapsulated through wire interconnect (TWI) | David R. Hembree | 2015-04-28 |
| 9013044 | Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact | David R. Hembree | 2015-04-21 |
| 8853072 | Methods of forming through-substrate interconnects | Philip J. Ireland | 2014-10-07 |
| 8786097 | Method of forming vias in semiconductor substrates and resulting structures | Charles M. Watkins, Kyle K. Kirby, Salman Akram, Warren M. Farnworth | 2014-07-22 |
| 8741667 | Method for fabricating a through wire interconnect (TWI) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer | David R. Hembree | 2014-06-03 |
| 8728921 | Method for fabricating semiconductor components having lasered features containing dopants | Tim J. Corbett | 2014-05-20 |
| 8704380 | Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods | Warren M. Farnworth | 2014-04-22 |
| 8669179 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2014-03-11 |
| 8581387 | Through wire interconnect (TWI) having bonded connection and encapsulating polymer layer | David R. Hembree | 2013-11-12 |
| 8546931 | Stacked semiconductor components having conductive interconnects | William M. Hiatt, David R. Hembree | 2013-10-01 |
| 8530895 | Thinned semiconductor components having lasered features and method of fabrication | Tim J. Corbett | 2013-09-10 |
| 8513797 | Stacked semiconductor component having through wire interconnect (TWI) with compressed wire | David R. Hembree | 2013-08-20 |
| 8502353 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2013-08-06 |
| 8455983 | Microelectronic device wafers and methods of manufacturing | Ed A. Schrock, Ford B. Grigg | 2013-06-04 |
| 8404523 | Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI) | David R. Hembree | 2013-03-26 |
| 8324100 | Methods of forming conductive vias | Salman Akram, William M. Hiatt, Steven Oliver, Sidney B. Rigg, James M. Wark +1 more | 2012-12-04 |
| 8294273 | Methods for fabricating and filling conductive vias and conductive vias so formed | Salman Akram, William M. Hiatt, Steve Oliver, Sidney B. Rigg, James M. Wark +1 more | 2012-10-23 |
| 8258006 | Method for fabricating stacked semiconductor components | — | 2012-09-04 |
| 8217510 | Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI) | David R. Hembree | 2012-07-10 |
| 8193646 | Semiconductor component having through wire interconnect (TWI) with compressed wire | David R. Hembree | 2012-06-05 |
| 8187983 | Methods for fabricating semiconductor components using thinning and back side laser processing | Tim J. Corbett | 2012-05-29 |
| 8120167 | System with semiconductor components having encapsulated through wire interconnects (TWI) | David R. Hembree | 2012-02-21 |
| 8062958 | Microelectronic device wafers and methods of manufacturing | Ed A. Schrock, Ford B. Grigg | 2011-11-22 |