Issued Patents All Time
Showing 51–75 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7591069 | Methods of bonding solder balls to bond pads on a substrate, and bonding frames | Warren M. Farnworth | 2009-09-22 |
| 7589406 | Stacked semiconductor component | — | 2009-09-15 |
| 7589010 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, James M. Wark, David R. Hembree, Syed Sajid Ahmad, Michael E. Hess +1 more | 2009-09-15 |
| 7579267 | Methods and systems for fabricating semiconductor components with through wire interconnects (TWI) | David R. Hembree | 2009-08-25 |
| 7561938 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2009-07-14 |
| 7538413 | Semiconductor components having through interconnects | Warren M. Farnworth, David R. Hembree | 2009-05-26 |
| 7521296 | Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material | Warren M. Farnworth, Charles M. Watkins, Peter Benson | 2009-04-21 |
| 7511520 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett, Warren M. Farnworth | 2009-03-31 |
| 7504615 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Peter Benson, James M. Wark +4 more | 2009-03-17 |
| 7498675 | Semiconductor component having plate, stacked dice and conductive vias | Warren M. Farnworth, William M. Hiatt, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2009-03-03 |
| 7488899 | Compliant contact pin assembly and card system | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree | 2009-02-10 |
| 7488618 | Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same | Warren M. Farnworth, Charles M. Watkins, Peter Benson | 2009-02-10 |
| 7482702 | Semiconductor component sealed on five sides by polymer sealing layer | Warren M. Farnworth, Trung T. Doan | 2009-01-27 |
| 7473582 | Method for fabricating semiconductor component with thinned substrate having pin contacts | Trung T. Doan | 2009-01-06 |
| 7459393 | Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts | Warren M. Farnworth, William M. Hiatt, James M. Wark, David R. Hembree, Kyle K. Kirby +1 more | 2008-12-02 |
| 7442643 | Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials | Warren M. Farnworth, Charles M. Watkins, Peter Benson | 2008-10-28 |
| 7432600 | System having semiconductor component with multiple stacked dice | Dean A. Klein, Trung T. Doan | 2008-10-07 |
| 7432604 | Semiconductor component and system having thinned, encapsulated dice | Warren M. Farnworth, Trung T. Doan | 2008-10-07 |
| 7429529 | Methods of forming through-wafer interconnects and structures resulting therefrom | Warren M. Farnworth | 2008-09-30 |
| 7419841 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson +4 more | 2008-09-02 |
| 7417325 | Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts | Warren M. Farnworth, Trung T. Doan | 2008-08-26 |
| 7394267 | Compliant contact pin assembly and card system | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree | 2008-07-01 |
| 7393770 | Backside method for fabricating semiconductor components with conductive interconnects | William M. Hiatt, David R. Hembree | 2008-07-01 |
| 7388294 | Semiconductor components having stacked dice | Dean A. Klein, Trung T. Doan | 2008-06-17 |
| 7385412 | Systems and methods for testing microfeature devices | Salman Akram, William M. Hiatt, Charles M. Watkins, Kyle K. Kirby | 2008-06-10 |