Issued Patents All Time
Showing 101–125 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7214566 | Semiconductor device package and method | Larry D. Kinsman | 2007-05-08 |
| 7205221 | Under bump metallization pad and solder bump connections | Salman Akram | 2007-04-17 |
| 7199439 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson +4 more | 2007-04-03 |
| 7189954 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Peter Benson, James M. Wark +4 more | 2007-03-13 |
| 7167014 | Method for testing using a universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2007-01-23 |
| 7167012 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2007-01-23 |
| 7161373 | Method for testing using a universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2007-01-09 |
| 7157353 | Method for fabricating encapsulated semiconductor components | Warren M. Farnworth, Trung T. Doan | 2007-01-02 |
| 7155300 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2006-12-26 |
| 7148715 | Systems and methods for testing microelectronic imagers and microfeature devices | Salman Akram, William M. Hiatt, Charles M. Watkins, Kyle K. Kirby | 2006-12-12 |
| 7141997 | Method for testing using a universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2006-11-28 |
| 7132366 | Method for fabricating semiconductor components using conductive layer and grooves | Warren M. Farnworth | 2006-11-07 |
| 7132731 | Semiconductor component and assembly having female conductive members | Trung T. Doan | 2006-11-07 |
| 7129725 | Semiconductor test interconnect with variable flexure contacts having polymer material | Salman Akram | 2006-10-31 |
| 7129156 | Method for fabricating a silicon carbide interconnect for semiconductor components using heating | Salman Akram | 2006-10-31 |
| 7120513 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2006-10-10 |
| 7112985 | Method for testing using a universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2006-09-26 |
| 7112986 | Method for testing using a universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2006-09-26 |
| 7093358 | Method for fabricating an interposer | Salman Akram, Warren M. Farnworth | 2006-08-22 |
| 7091065 | Method of making a center bond flip chip semiconductor carrier | Tongbi Jiang | 2006-08-15 |
| 7087511 | Method for conducting heat in a flip-chip assembly | Salman Akram | 2006-08-08 |
| 7084013 | Methods for forming protective layers on semiconductor device substrates | Warren M. Farnworth | 2006-08-01 |
| 7084351 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, J. Michael Brooks, Eugene H. Cloud | 2006-08-01 |
| 7081665 | Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts | Trung T. Doan | 2006-07-25 |
| 7078266 | Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts | Trung T. Doan | 2006-07-18 |