Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763185 | Packaged semiconductor components having substantially rigid support members | Matt E. Schwab, David J. Corisis | 2020-09-01 |
| 10692827 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, David J. Corisis | 2020-06-23 |
| 10312173 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Matt E. Schwab, David J. Corisis | 2019-06-04 |
| 10163826 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, David J. Corisis | 2018-12-25 |
| 9960094 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Matt E. Schwab, David J. Corisis | 2018-05-01 |
| 9812415 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, David J. Corisis | 2017-11-07 |
| 9362208 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Matt E. Schwab, David J. Corisis | 2016-06-07 |
| 8866272 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, David J. Corisis | 2014-10-21 |
| 8138021 | Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components | David J. Corisis, Choon Kuan Lee, Chin Hui Chong | 2012-03-20 |
| 8138613 | Microelectronic devices | Young Do Kweon, Tongbi Jiang | 2012-03-20 |
| 7955898 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Matt E. Schwab, David J. Corisis | 2011-06-07 |
| 7910385 | Method of fabricating microelectronic devices | Young Do Kweon, Tongbi Jiang | 2011-03-22 |
| 7759785 | Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components | David J. Corisis, Choon Kuan Lee, Chin Hui Chong | 2010-07-20 |
| 7750449 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Matt E. Schwab, David J. Corisis | 2010-07-06 |
| 7655500 | Packaged microelectronic devices and methods for packaging microelectronic devices | Tongbi Jiang | 2010-02-02 |
| 7550847 | Packaged microelectronic devices and methods for packaging microelectronic devices | Tongbi Jiang | 2009-06-23 |
| 7329949 | Packaged microelectronic devices and methods for packaging microelectronic devices | Tongbi Jiang | 2008-02-12 |
| 7298031 | Multiple substrate microelectronic devices and methods of manufacture | Tongbi Jiang | 2007-11-20 |
| 7253025 | Multiple substrate microelectronic devices and methods of manufacture | Tongbi Jiang | 2007-08-07 |
| 7084351 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, Alan G. Wood, Eugene H. Cloud | 2006-08-01 |
| 6914198 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, Alan G. Wood, Eugene H. Cloud | 2005-07-05 |
| 6909055 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, Alan G. Wood, Eugene H. Cloud | 2005-06-21 |
| 6535393 | Electrical device allowing for increased device densities | Salman Akram, Warren M. Farnworth, Alan G. Wood, Eugene H. Cloud | 2003-03-18 |