| 10763185 |
Packaged semiconductor components having substantially rigid support members |
Matt E. Schwab, David J. Corisis |
2020-09-01 |
$15,473,000 |
| 10692827 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
Matt E. Schwab, David J. Corisis |
2020-06-23 |
$14,650,000 |
| 10312173 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components |
Matt E. Schwab, David J. Corisis |
2019-06-04 |
$9,801,000 |
| 10163826 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
Matt E. Schwab, David J. Corisis |
2018-12-25 |
|
| 9960094 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components |
Matt E. Schwab, David J. Corisis |
2018-05-01 |
$34,806,000 |
| 9812415 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
Matt E. Schwab, David J. Corisis |
2017-11-07 |
$52,193,000 |
| 9362208 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components |
Matt E. Schwab, David J. Corisis |
2016-06-07 |
$8,315,000 |
| 8866272 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
Matt E. Schwab, David J. Corisis |
2014-10-21 |
$19,042,000 |
| 8138021 |
Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components |
David J. Corisis, Choon Kuan Lee, Chin Hui Chong |
2012-03-20 |
$6,038,000 |
| 8138613 |
Microelectronic devices |
Young Do Kweon, Tongbi Jiang |
2012-03-20 |
$6,038,000 |
| 7955898 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
Matt E. Schwab, David J. Corisis |
2011-06-07 |
$3,124,000 |
| 7910385 |
Method of fabricating microelectronic devices |
Young Do Kweon, Tongbi Jiang |
2011-03-22 |
$4,142,000 |
| 7759785 |
Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components |
David J. Corisis, Choon Kuan Lee, Chin Hui Chong |
2010-07-20 |
$2,641,000 |
| 7750449 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components |
Matt E. Schwab, David J. Corisis |
2010-07-06 |
$2,361,000 |
| 7655500 |
Packaged microelectronic devices and methods for packaging microelectronic devices |
Tongbi Jiang |
2010-02-02 |
$3,689,000 |
| 7550847 |
Packaged microelectronic devices and methods for packaging microelectronic devices |
Tongbi Jiang |
2009-06-23 |
$3,802,000 |
| 7329949 |
Packaged microelectronic devices and methods for packaging microelectronic devices |
Tongbi Jiang |
2008-02-12 |
$1,579,000 |
| 7298031 |
Multiple substrate microelectronic devices and methods of manufacture |
Tongbi Jiang |
2007-11-20 |
$1,959,000 |
| 7253025 |
Multiple substrate microelectronic devices and methods of manufacture |
Tongbi Jiang |
2007-08-07 |
$1,952,000 |
| 7084351 |
Electrical device allowing for increased device densities |
Salman Akram, Warren M. Farnworth, Alan G. Wood, Eugene H. Cloud |
2006-08-01 |
$2,483,000 |
| 6914198 |
Electrical device allowing for increased device densities |
Salman Akram, Warren M. Farnworth, Alan G. Wood, Eugene H. Cloud |
2005-07-05 |
$1,616,000 |
| 6909055 |
Electrical device allowing for increased device densities |
Salman Akram, Warren M. Farnworth, Alan G. Wood, Eugene H. Cloud |
2005-06-21 |
$1,292,000 |
| 6535393 |
Electrical device allowing for increased device densities |
Salman Akram, Warren M. Farnworth, Alan G. Wood, Eugene H. Cloud |
2003-03-18 |
$2,171,000 |
