Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electrical device allowing for increased device densities

Electrical device allowing for increased device densities

US Patent 6909055 · Granted Jun 21, 2005

Estimated economic value: $1,292,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of bonding a semiconductor device to a support substrate2023
Elevated pocket pixels, imaging devices and systems including the same and metho2023
Methods and systems for imaging and cutting semiconductor wafers and other semic2022
Chip scale light emitting device package with dome2021
Elevated pocket pixels, imaging devices and systems including the same and metho2021
Microfeature workpieces having alloyed conductive structures, and associated met2021
Packaged semiconductor components having substantially rigid support members2020
Laser de-bond carrier wafer from device wafer2020
Packaged microelectronic devices and methods for manufacturing packaged microele2020
Microfeature workpieces having alloyed conductive structures, and associated met2020
Elevated pocket pixels, imaging devices and systems including the same and metho2019
Hybrid gate dielectrics for semiconductor power devices2019