| 7869242 |
Transmission lines for CMOS integrated circuits |
Leonard Forbes, Kie Y. Ahn |
2011-01-11 |
$3,670,000 |
| 7567091 |
Method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer |
Warren M. Farnworth, William K. Waller, Leland R. Nevill, Raymond J. Beffa |
2009-07-28 |
$5,815,000 |
| 7554829 |
Transmission lines for CMOS integrated circuits |
Leonard Forbes, Kie Y. Ahn |
2009-06-30 |
$4,341,000 |
| 7323896 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer |
Warren M. Farnworth, William K. Waller, Leland R. Nevill, Raymond J. Beffa |
2008-01-29 |
$1,719,000 |
| 7315179 |
System for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer |
Warren M. Farnworth, William K. Waller, Leland R. Nevill, Raymond J. Beffa |
2008-01-01 |
|
| 7297915 |
Compensation methods and systems for imaging detectors |
David J. McElroy |
2007-11-20 |
$1,959,000 |
| 7276926 |
Method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer |
Warren M. Farnworth, William K. Waller, Leland R. Nevill, Raymond J. Beffa |
2007-10-02 |
$909,000 |
| 7276927 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer |
Warren M. Farnworth, William K. Waller, Leland R. Nevill, Raymond J. Beffa |
2007-10-02 |
$909,000 |
| 7259450 |
Double-packaged multi-chip semiconductor module |
Alan G. Wood, Larry D. Kinsman |
2007-08-21 |
$2,251,000 |
| 7129457 |
Redundant imaging systems |
David J. McElroy |
2006-10-31 |
$2,448,000 |
| 7101778 |
Transmission lines for CMOS integrated circuits |
Leonard Forbes, Kie Y. Ahn |
2006-09-05 |
$2,273,000 |
| 7084351 |
Electrical device allowing for increased device densities |
Salman Akram, Warren M. Farnworth, Alan G. Wood, J. Michael Brooks |
2006-08-01 |
$2,483,000 |
| 7034561 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer |
Warren M. Farnworth, William K. Waller, Leland R. Nevill, Raymond J. Beffa |
2006-04-25 |
$2,785,000 |
| 7022553 |
Compact system module with built-in thermoelectric cooling |
Kie Y. Ahn, Leonard Forbes |
2006-04-04 |
$2,376,000 |
| 7023040 |
DRAM technology compatible processor/memory chips |
Leonard Forbes, Wendell P. Noble |
2006-04-04 |
$2,376,000 |
| RE38956 |
Data compression circuit and method for testing memory devices |
Ray Beffa, Leland R. Nevill, Neil L. Hansen |
2006-01-31 |
|
| 6984544 |
Die to die connection method and assemblies and packages including dice so connected |
Paul A. Farrar |
2006-01-10 |
$2,550,000 |
| 6924194 |
DRAM technology compatible processor/memory chips |
Leonard Forbes, Wendell P. Noble |
2005-08-02 |
$1,941,000 |
| 6914198 |
Electrical device allowing for increased device densities |
Salman Akram, Warren M. Farnworth, Alan G. Wood, J. Michael Brooks |
2005-07-05 |
$1,616,000 |
| 6909635 |
Programmable memory cell using charge trapping in a gate oxide |
Leonard Forbes, Wendell P. Noble |
2005-06-21 |
$1,292,000 |
| 6909055 |
Electrical device allowing for increased device densities |
Salman Akram, Warren M. Farnworth, Alan G. Wood, J. Michael Brooks |
2005-06-21 |
$1,292,000 |
| 6906408 |
Assemblies and packages including die-to-die connections |
Paul A. Farrar |
2005-06-14 |
$1,402,000 |
| 6862662 |
High density storage scheme for semiconductor memory |
— |
2005-03-01 |
$1,260,000 |
| 6852999 |
Reduced terminal testing system |
Warren M. Farnworth, Leland R. Nevill, Raymond J. Beffa |
2005-02-08 |
$1,358,000 |
| 6831475 |
Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer |
Warren M. Farnworth, William K. Waller, Leland R. Nevill, Raymond J. Beffa |
2004-12-14 |
$1,542,000 |
