| 10763185 |
Packaged semiconductor components having substantially rigid support members |
J. Michael Brooks, David J. Corisis |
2020-09-01 |
$15,473,000 |
| 10692827 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
David J. Corisis, J. Michael Brooks |
2020-06-23 |
$14,650,000 |
| 10312173 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components |
J. Michael Brooks, David J. Corisis |
2019-06-04 |
$9,801,000 |
| 10297574 |
System in package (SIP) with dual laminate interposers |
David J. Corisis |
2019-05-21 |
$20,228,000 |
| 10163826 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
David J. Corisis, J. Michael Brooks |
2018-12-25 |
|
| 9960094 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components |
J. Michael Brooks, David J. Corisis |
2018-05-01 |
$34,806,000 |
| 9812415 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
David J. Corisis, J. Michael Brooks |
2017-11-07 |
$52,193,000 |
| 9362208 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components |
J. Michael Brooks, David J. Corisis |
2016-06-07 |
$8,315,000 |
| 8987885 |
Packaged microdevices and methods for manufacturing packaged microdevices |
Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal |
2015-03-24 |
$9,898,000 |
| 8866272 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
J. Michael Brooks, David J. Corisis |
2014-10-21 |
$19,042,000 |
| 8735183 |
System in package (SIP) with dual laminate interposers |
David J. Corisis |
2014-05-27 |
$8,446,000 |
| 8354301 |
Packaged microdevices and methods for manufacturing packaged microdevices |
Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal |
2013-01-15 |
$5,048,000 |
| 8048715 |
Multi-chip module and methods |
David J. Corisis, Jerry M. Brooks |
2011-11-01 |
|
| 7955898 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
J. Michael Brooks, David J. Corisis |
2011-06-07 |
$3,124,000 |
| 7944057 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds |
2011-05-17 |
|
| 7868440 |
Packaged microdevices and methods for manufacturing packaged microdevices |
Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal |
2011-01-11 |
$3,670,000 |
| 7851922 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds |
2010-12-14 |
|
| 7750449 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components |
J. Michael Brooks, David J. Corisis |
2010-07-06 |
$2,361,000 |
| 7619313 |
Multi-chip module and methods |
David J. Corisis, Jerry M. Brooks |
2009-11-17 |
$4,692,000 |
| 7423336 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds |
2008-09-09 |
$1,324,000 |
| 7372131 |
Routing element for use in semiconductor device assemblies |
David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds |
2008-05-13 |
$1,487,000 |
| 7372138 |
Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods |
David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds |
2008-05-13 |
$1,487,000 |
| 7344921 |
Integrated circuit device having reduced bow and method for making same |
William Tandy, Cary J. Baerlocher |
2008-03-18 |
$1,356,000 |
| 7335571 |
Method of making a semiconductor device having an opening in a solder mask |
Brad D. Rumsey |
2008-02-26 |
$1,909,000 |
| 7282397 |
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices |
David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds |
2007-10-16 |
$1,318,000 |
