Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763185 | Packaged semiconductor components having substantially rigid support members | J. Michael Brooks, David J. Corisis | 2020-09-01 |
| 10692827 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | David J. Corisis, J. Michael Brooks | 2020-06-23 |
| 10312173 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | J. Michael Brooks, David J. Corisis | 2019-06-04 |
| 10297574 | System in package (SIP) with dual laminate interposers | David J. Corisis | 2019-05-21 |
| 10163826 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | David J. Corisis, J. Michael Brooks | 2018-12-25 |
| 9960094 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | J. Michael Brooks, David J. Corisis | 2018-05-01 |
| 9812415 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | David J. Corisis, J. Michael Brooks | 2017-11-07 |
| 9362208 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | J. Michael Brooks, David J. Corisis | 2016-06-07 |
| 8987885 | Packaged microdevices and methods for manufacturing packaged microdevices | Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal | 2015-03-24 |
| 8866272 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | J. Michael Brooks, David J. Corisis | 2014-10-21 |
| 8735183 | System in package (SIP) with dual laminate interposers | David J. Corisis | 2014-05-27 |
| 8354301 | Packaged microdevices and methods for manufacturing packaged microdevices | Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal | 2013-01-15 |
| 8048715 | Multi-chip module and methods | David J. Corisis, Jerry M. Brooks | 2011-11-01 |
| 7955898 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | J. Michael Brooks, David J. Corisis | 2011-06-07 |
| 7944057 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds | 2011-05-17 |
| 7868440 | Packaged microdevices and methods for manufacturing packaged microdevices | Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal | 2011-01-11 |
| 7851922 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds | 2010-12-14 |
| 7750449 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | J. Michael Brooks, David J. Corisis | 2010-07-06 |
| 7619313 | Multi-chip module and methods | David J. Corisis, Jerry M. Brooks | 2009-11-17 |
| 7423336 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds | 2008-09-09 |
| 7372131 | Routing element for use in semiconductor device assemblies | David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds | 2008-05-13 |
| 7372138 | Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods | David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds | 2008-05-13 |
| 7344921 | Integrated circuit device having reduced bow and method for making same | William Tandy, Cary J. Baerlocher | 2008-03-18 |
| 7335571 | Method of making a semiconductor device having an opening in a solder mask | Brad D. Rumsey | 2008-02-26 |
| 7282397 | Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices | David J. Corisis, Jerry M. Brooks, Tracy V. Reynolds | 2007-10-16 |