Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaged microdevices and methods for manufacturing packaged microdevices

Packaged microdevices and methods for manufacturing packaged microdevices

US Patent 8987885 · Granted Mar 24, 2015

Estimated economic value: $9,898,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Proximity coupling interconnect packaging systems and methods2022
Packaged semiconductor components having substantially rigid support members2020
Packaged microelectronic devices and methods for manufacturing packaged microele2020
Computer modules with small thicknesses and associated methods of manufacturing2019
Proximity coupling interconnect packaging systems and methods2019
Packaged semiconductor components having substantially rigid support members and2019
System in package (SIP) with dual laminate interposers2019
Computer modules with small thicknesses and associated methods of manufacturing2019
Packaged microelectronic devices and methods for manufacturing packaged microele2018
Proximity coupling of interconnect packaging systems and methods2018
Packaged semiconductor components having substantially rigid support members and2018
Packaged microelectronic devices and methods for manufacturing packaged microele2017