Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522515 | Computer modules with small thicknesses and associated methods of manufacturing | Kevin Gibbons, David J. Corisis | 2019-12-31 |
| 10256214 | Computer modules with small thicknesses and associated methods of manufacturing | Kevin Gibbons, David J. Corisis | 2019-04-09 |
| 9717157 | Computer modules with small thicknesses and associated methods of manufacturing | Kevin Gibbons, David J. Corisis | 2017-07-25 |
| 8987885 | Packaged microdevices and methods for manufacturing packaged microdevices | Stuart L. Roberts, Rich Fogal, Matt E. Schwab | 2015-03-24 |
| 8959759 | Method for assembling computer modules small in thickness | Kevin Gibbons, David J. Corisis | 2015-02-24 |
| 8644030 | Computer modules with small thicknesses and associated methods of manufacturing | Kevin Gibbons, David J. Corisis | 2014-02-04 |
| 8354301 | Packaged microdevices and methods for manufacturing packaged microdevices | Stuart L. Roberts, Rich Fogal, Matt E. Schwab | 2013-01-15 |
| 7944057 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2011-05-17 |
| 7868440 | Packaged microdevices and methods for manufacturing packaged microdevices | Stuart L. Roberts, Rich Fogal, Matt E. Schwab | 2011-01-11 |
| 7851922 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2010-12-14 |
| 7423336 | Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2008-09-09 |
| 7372131 | Routing element for use in semiconductor device assemblies | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2008-05-13 |
| 7372138 | Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2008-05-13 |
| 7282805 | Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2007-10-16 |
| 7282397 | Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2007-10-16 |
| 7094631 | Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2006-08-22 |
| 6995043 | Methods for fabricating routing elements for multichip modules | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2006-02-07 |
| 6991970 | Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device | Rich Fogal, Timothy B. Cowles | 2006-01-31 |
| 6987325 | Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2006-01-17 |
| 6882034 | Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods | David J. Corisis, Jerry M. Brooks, Matt E. Schwab | 2005-04-19 |
| 6858453 | Integrated circuit package alignment feature | David J. Corisis, Michael Slaughter, Daniel P. Cram, Leland R. Nevill | 2005-02-22 |
| 6836003 | Integrated circuit package alignment feature | David J. Corisis, Michael Slaughter, Daniel P. Cram, Leland R. Nevill, Jerrold L. King | 2004-12-28 |
| 6509205 | Apparatus and method for providing mechanically pre-formed conductive leads | Ronald W. Ellis, Michael J. Bettinger | 2003-01-21 |
| 6504257 | Apparatus and method for providing mechanically pre-formed conductive leads | Ronald W. Ellis, Michael J. Bettinger | 2003-01-07 |
| 6474532 | Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | Michael J. Bettinger, Ronald W. Ellis | 2002-11-05 |