Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8749261 | Interfaces having a plurality of connector assemblies | Scott Hoagland | 2014-06-10 |
| 8624615 | Isolation circuit | Hani S. Attalla | 2014-01-07 |
| 8074353 | Methods of providing semiconductor components within sockets | A. Jay Stutzman | 2011-12-13 |
| 8063646 | Apparatus and methods for testing microelectronic devices | A. Jay Stutzman | 2011-11-22 |
| 8011092 | Methods of providing semiconductor components within sockets | A. Jay Stutzman | 2011-09-06 |
| 8004297 | Isolation circuit | Hani S. Attalla | 2011-08-23 |
| 7918383 | Methods for placing substrates in contact with molten solder | Kyle K. Kirby, Salman Akram, Roy Lange, Warren M. Farnworth | 2011-04-05 |
| 7857646 | Electrical testing apparatus having masked sockets and associated systems and methods | A. Jay Stutzman | 2010-12-28 |
| 7692437 | Systems and methods for testing packaged microelectronic devices | A. Jay Stutzman | 2010-04-06 |
| 7586319 | Methods of retaining semiconductor component configurations within sockets | A. Jay Stutzman | 2009-09-08 |
| 7570069 | Resilient contact probes | Scott Hoagland | 2009-08-04 |
| 7541825 | Isolation circuit | Hani S. Attalla | 2009-06-02 |
| 7514945 | Systems configured for utilizing semiconductor components | A. Jay Stutzman | 2009-04-07 |
| 7456504 | Electronic component assemblies with electrically conductive bonds | Steven L. Hamren | 2008-11-25 |
| 7439752 | Methods of providing semiconductor components within sockets | A. Jay Stutzman | 2008-10-21 |
| 7427869 | Resilient contact probe apparatus | Scott Hoagland | 2008-09-23 |
| 7425839 | Systems and methods for testing packaged microelectronic devices | A. Jay Stutzman | 2008-09-16 |
| 7279915 | Test method for electronic modules using movable test contactors | — | 2007-10-09 |
| 7274197 | Contact system for interfacing a semiconductor wafer to an electrical tester | — | 2007-09-25 |
| 7265563 | Test method for semiconductor components using anisotropic conductive polymer contact system | — | 2007-09-04 |
| 7176702 | Contact system for wafer level testing | — | 2007-02-13 |
| 7135345 | Methods for processing semiconductor devices in a singulated form | Steven L. Hamren | 2006-11-14 |
| 7129721 | Method and apparatus for processing semiconductor devices in a singulated form | Steven L. Hamren | 2006-10-31 |
| 7126228 | Apparatus for processing semiconductor devices in a singulated form | Steven L. Hamren | 2006-10-24 |
| 7121860 | Pinch-style support contact, method of enabling electrical communication with and supporting an IC package, and socket including same | Amos Stutzman | 2006-10-17 |