Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7122389 | Method for processing semiconductor devices in a singulated form | Steven L. Hamren | 2006-10-17 |
| 7123036 | Test method for electronic modules | — | 2006-10-17 |
| 7114976 | Test socket and test system for semiconductor components with easily removable nest | — | 2006-10-03 |
| 7093622 | Apparatus for deforming resilient contact structures on semiconductor components | — | 2006-08-22 |
| 7043388 | System and apparatus for testing packaged devices and related methods | — | 2006-05-09 |
| 7038475 | Test method for semiconductor components using conductive polymer contact system | — | 2006-05-02 |
| 6998862 | Test socket for semiconductor components having serviceable nest | — | 2006-02-14 |
| 6966424 | Bladder based package control/singulation | — | 2005-11-22 |
| 6888364 | Test system and test contactor for electronic modules | — | 2005-05-03 |
| 6858453 | Integrated circuit package alignment feature | David J. Corisis, Tracy V. Reynolds, Michael Slaughter, Leland R. Nevill | 2005-02-22 |
| 6856151 | Conductive polymer contact system and test method for semiconductor components | — | 2005-02-15 |
| 6836003 | Integrated circuit package alignment feature | David J. Corisis, Tracy V. Reynolds, Michael Slaughter, Leland R. Nevill, Jerrold L. King | 2004-12-28 |
| 6825685 | Method and system for wafer level testing and burning-in semiconductor components | — | 2004-11-30 |
| 6756802 | Test system for electronic modules having contactors with spring segment terminal portions | — | 2004-06-29 |
| 6741091 | Test method for electronic modules using contractors and conductive polymer contacts | — | 2004-05-25 |
| 6727715 | Test system and test contactor for electronic modules having beam spring contacts | — | 2004-04-27 |
| 6624653 | Method and system for wafer level testing and burning-in semiconductor components | — | 2003-09-23 |
| 6585097 | Bladder based package control/singulation | — | 2003-07-01 |
| 6489794 | High speed pass through test system and test method for electronic modules | — | 2002-12-03 |
| 6483329 | Test system, test contactor, and test method for electronic modules | — | 2002-11-19 |
| 6462575 | Method and system for wafer level testing and burning-in semiconductor components | — | 2002-10-08 |
| 6462568 | Conductive polymer contact system and test method for semiconductor components | — | 2002-10-08 |
| 6246108 | Integrated circuit package including lead frame with electrically isolated alignment feature | David J. Corisis, Tracy V. Reynolds, Michael Slaughter, Leland R. Nevill, Jerrold L. King | 2001-06-12 |
| 6048744 | Integrated circuit package alignment feature | David J. Corisis, Tracy V. Reynolds, Michael Slaughter, Leland R. Nevill, Jerrold L. King | 2000-04-11 |