Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6454153 | Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | Michael J. Bettinger, Ronald W. Ellis | 2002-09-24 |
| 6357275 | Apparatus and method for providing mechanically pre-formed conductive leads | Ronald W. Ellis, Michael J. Bettinger | 2002-03-19 |
| 6246108 | Integrated circuit package including lead frame with electrically isolated alignment feature | David J. Corisis, Michael Slaughter, Daniel P. Cram, Leland R. Nevill, Jerrold L. King | 2001-06-12 |
| 6221748 | Apparatus and method for providing mechanically pre-formed conductive leads | Ronald W. Ellis, Michael J. Bettinger | 2001-04-24 |
| 6199743 | Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | Michael J. Bettinger, Ronald W. Ellis | 2001-03-13 |
| 6048744 | Integrated circuit package alignment feature | David J. Corisis, Michael Slaughter, Daniel P. Cram, Leland R. Nevill, Jerrold L. King | 2000-04-11 |