Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7677429 | Concave face wire bond capillary and method | Gregory M. Chapman, Jennifer A. Due | 2010-03-16 |
| 7416107 | Concave face wire bond capillary and method | Gregory M. Chapman, Jennifer A. Due | 2008-08-26 |
| 6966480 | Concave face wire bond capillary and method | Gregory M. Chapman, Jennifer A. Due | 2005-11-22 |
| 6655535 | Methods for facilitating circuit board processing | James M. Wark | 2003-12-02 |
| 6595406 | Concave face wire bond capillary and method | Gregory M. Chapman, Jennifer A. Due | 2003-07-22 |
| 6509205 | Apparatus and method for providing mechanically pre-formed conductive leads | Ronald W. Ellis, Tracy V. Reynolds | 2003-01-21 |
| 6504257 | Apparatus and method for providing mechanically pre-formed conductive leads | Ronald W. Ellis, Tracy V. Reynolds | 2003-01-07 |
| 6474532 | Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | Ronald W. Ellis, Tracy V. Reynolds | 2002-11-05 |
| 6454153 | Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | Ronald W. Ellis, Tracy V. Reynolds | 2002-09-24 |
| 6439450 | Concave face wire bond capillary | Gregory M. Chapman, Jennifer A. Due | 2002-08-27 |
| 6398043 | Apparatus and method for facilitating circuit board processing | James M. Wark | 2002-06-04 |
| 6357275 | Apparatus and method for providing mechanically pre-formed conductive leads | Ronald W. Ellis, Tracy V. Reynolds | 2002-03-19 |
| 6311890 | Concave face wire bond capillary | Gregory M. Chapman, Jennifer A. Due | 2001-11-06 |
| 6279758 | Apparatus and method for facilitating circuit board processing | James M. Wark | 2001-08-28 |
| 6221748 | Apparatus and method for providing mechanically pre-formed conductive leads | Ronald W. Ellis, Tracy V. Reynolds | 2001-04-24 |
| 6199743 | Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | Ronald W. Ellis, Tracy V. Reynolds | 2001-03-13 |
| 6158595 | Apparatus and method for facilitating circuit board processing | James M. Wark | 2000-12-12 |
| 6158647 | Concave face wire bond capillary | Gregory M. Chapman, Jennifer A. Due | 2000-12-12 |
| 5992649 | Apparatus and method for facilitating circuit board processing | James M. Wark | 1999-11-30 |
| 5988619 | Apparatus and method for facilitating circuit board processing | James M. Wark | 1999-11-23 |
| 5911329 | Apparatus and method for facilitating circuit board processing | James M. Wark | 1999-06-15 |
| 5831504 | Actuator assembly | John G. Piper | 1998-11-03 |
| 5644279 | Actuator assembly | John G. Piper | 1997-07-01 |
| 5315255 | Non-contact, electrostatic, discharge detector | — | 1994-05-24 |