Issued Patents All Time
Showing 1–25 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398465 | Proximity coupling interconnect packaging systems and methods | Owen R. Fay | 2022-07-26 |
| 10381336 | Proximity coupling interconnect packaging systems and methods | Owen R. Fay | 2019-08-13 |
| 10062678 | Proximity coupling of interconnect packaging systems and methods | Owen R. Fay | 2018-08-28 |
| 9595513 | Proximity coupling of interconnect packaging systems and methods | Owen R. Fay | 2017-03-14 |
| 8987885 | Packaged microdevices and methods for manufacturing packaged microdevices | Stuart L. Roberts, Tracy V. Reynolds, Matt E. Schwab | 2015-03-24 |
| 8354301 | Packaged microdevices and methods for manufacturing packaged microdevices | Stuart L. Roberts, Tracy V. Reynolds, Matt E. Schwab | 2013-01-15 |
| 7977597 | Wire bonders and methods of wire-bonding | Stuart L. Roberts | 2011-07-12 |
| 7868440 | Packaged microdevices and methods for manufacturing packaged microdevices | Stuart L. Roberts, Tracy V. Reynolds, Matt E. Schwab | 2011-01-11 |
| 7227095 | Wire bonders and methods of wire-bonding | Stuart L. Roberts | 2007-06-05 |
| 6991970 | Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device | Tracy V. Reynolds, Timothy B. Cowles | 2006-01-31 |
| 6886734 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Michael B. Ball | 2005-05-03 |
| 6884657 | Angularly offset stacked die multichip device and method of manufacture | Michael B. Ball | 2005-04-26 |
| 6845898 | Bondhead lead clamp apparatus | Michael B. Ball | 2005-01-25 |
| 6837418 | Bondhead lead clamp apparatus and method | Michael B. Ball | 2005-01-04 |
| 6793749 | Automated method of attaching flip-chip devices to a substrate | John VanNortwick, Chad A. Cobbley | 2004-09-21 |
| 6786387 | Method for clamping and wire-bonding the leads of a lead frame one set at a time | Michael B. Ball | 2004-09-07 |
| 6773523 | Automated method of attaching flip chip devices to a substrate | John VanNortwick, Chad A. Cobbley | 2004-08-10 |
| 6662993 | Bondhead lead clamp apparatus | Michael B. Ball | 2003-12-16 |
| 6620706 | Condensed memory matrix | Alan G. Wood | 2003-09-16 |
| 6607121 | Quick change precisor | Michael B. Ball, Ronald W. Ellis | 2003-08-19 |
| 6604671 | Bondhead lead clamp apparatus and method | Michael B. Ball | 2003-08-12 |
| 6563205 | Angularly offset and recessed stacked die multichip device and method of manufacture | Michael B. Ball | 2003-05-13 |
| 6537400 | Automated method of attaching flip chip devices to a substrate | John VanNortwick, Chad A. Cobbley | 2003-03-25 |
| 6478211 | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time | Michael B. Ball | 2002-11-12 |
| 6467672 | Methods for clamping and wire-bonding the leads of a lead frame one set at a time | Michael B. Ball | 2002-10-22 |