Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5971256 | Quick change precisor | Michael B. Ball, Ronald W. Ellis | 1999-10-26 |
| 5963794 | Angularly offset stacked die multichip device and method of manufacture | Michael B. Ball | 1999-10-05 |
| 5954842 | Lead finger clamp assembly | Michael B. Ball | 1999-09-21 |
| 5918107 | Method and system for fabricating and testing assemblies containing wire bonded semiconductor dice | Steve W. Heppler | 1999-06-29 |
| 5905305 | Condensed memory matrix | Alan G. Wood | 1999-05-18 |
| 5886412 | Angularly offset and recessed stacked die multichip device | Michael B. Ball | 1999-03-23 |
| 5874781 | Angularly offset stacked die multichip device and method of manufacture | Michael B. Ball | 1999-02-23 |
| 5813590 | Extended travel wire bonding machine | Michael B. Ball | 1998-09-29 |
| 5758942 | Mechanical vision system using selective wavelength and brightness illumination | Michael B. Ball, Mike Bettinger | 1998-06-02 |
| 5721452 | Angularly offset stacked die multichip device and method of manufacture | Michael B. Ball | 1998-02-24 |
| 5662261 | Wire bonding capillary | — | 1997-09-02 |
| 5647528 | Bondhead lead clamp apparatus and method | Michael B. Ball | 1997-07-15 |
| 5559366 | Lead finger tread for a semiconductor lead package system | Michael B. Ball | 1996-09-24 |
| 5350106 | Semiconductor wire bonding method | — | 1994-09-27 |
| 5322207 | Method and apparatus for wire bonding semiconductor dice to a leadframe | Chender Huang, Mike Ball | 1994-06-21 |
| 5323060 | Multichip module having a stacked chip arrangement | Michael Ball | 1994-06-21 |
| 5177032 | Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape | Jerrold L. King, Walter L. Moden | 1993-01-05 |
| 5140404 | Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape | Jerrold L. King, Walter L. Moden | 1992-08-18 |